{"id":432,"date":"2026-04-27T07:09:46","date_gmt":"2026-04-27T07:09:46","guid":{"rendered":"https:\/\/ewirexon.com\/?page_id=432"},"modified":"2026-05-29T04:02:44","modified_gmt":"2026-05-29T04:02:44","slug":"sic-compound-semiconductor-processing","status":"publish","type":"page","link":"https:\/\/ewirexon.com\/de\/products\/sic-compound-semiconductor-processing\/","title":{"rendered":"SiC- und Verbindungshalbleiter-Verarbeitung"},"content":{"rendered":"\t\t<div data-elementor-type=\"wp-page\" data-elementor-id=\"432\" class=\"elementor elementor-432\" data-elementor-post-type=\"page\">\n\t\t\t\t<div class=\"elementor-element elementor-element-14d9338 e-flex e-con-boxed e-con e-parent\" data-id=\"14d9338\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t\t\n<hr class=\"e-e9fe659-d6eaea5 e-divider-base\" data-interaction-id=\"e9fe659\"  data-e-type=\"widget\" data-id=\"e9fe659\" \/>\n\t\t\t\t<div class=\"elementor-element elementor-element-5df15d3 elementor-widget elementor-widget-heading\" data-id=\"5df15d3\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<p class=\"elementor-heading-title elementor-size-default\">High-precision Diamond Wire Cutting Systems for Substrate Slicing<\/p>\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-79e7786 e-flex e-con-boxed e-con e-parent\" data-id=\"79e7786\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-c8bcc28 elementor-widget elementor-widget-woocommerce-breadcrumb\" data-id=\"c8bcc28\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"woocommerce-breadcrumb.default\">\n\t\t\t\t\t<nav class=\"woocommerce-breadcrumb\" aria-label=\"Breadcrumb\">Start<\/nav>\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a685e82 e-flex e-con-boxed e-con e-parent\" data-id=\"a685e82\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-d0f87fc elementor-widget elementor-widget-text-editor\" data-id=\"d0f87fc\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<div><div><p>SiC ingots, compound semiconductor substrates and wide-bandgap materials experience significant mechanical stress and thermal impact during high-speed slicing. To ensure excellent surface quality, minimal sub-surface damage and avoid chipping or micro-cracks that lead to device failure, semiconductor manufacturers require highly stable cutting processes and precise process control. This is the only way to achieve reliable, high-yield production of high-quality wafers.<\/p><p>Processing SiC and compound semiconductors involves extremely high material and production costs. Around 30% of total substrate manufacturing cost comes from inefficient cutting, material loss and low yield, rather than raw materials alone. Choosing the right diamond wire cutting systems for specific applications can therefore greatly reduce production costs and improve efficiency.<\/p><p>High-precision diamond wire saws are used to slice hard, brittle ingots into thin wafers with stable tension and feed control. Their operating parameters are optimized for a stable process window with consistent wire tension, low vibration and narrow kerf width.<\/p><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e3b58a9 e-flex e-con-boxed e-con e-parent\" data-id=\"e3b58a9\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0edb6ae elementor-widget elementor-widget-heading\" data-id=\"0edb6ae\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">SiC &amp; Compound Semiconductor Processing<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f40b5db elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"f40b5db\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"divider.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-85958eb e-con-full e-flex e-con e-child\" data-id=\"85958eb\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-a38b2de elementor-widget__width-initial elementor-widget-mobile__width-inherit elementor-widget elementor-widget-n-accordion\" data-id=\"a38b2de\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;max_items_expended&quot;:&quot;multiple&quot;,&quot;default_state&quot;:&quot;expanded&quot;,&quot;n_accordion_animation_duration&quot;:{&quot;unit&quot;:&quot;ms&quot;,&quot;size&quot;:400,&quot;sizes&quot;:[]},&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"nested-accordion.default\">\n\t\t\t\t\t\t\t<div class=\"e-n-accordion\" aria-label=\"Accordion. Open links with Enter or Space, close with Escape, and navigate with Arrow Keys\">\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1710\" class=\"e-n-accordion-item\" open>\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"1\" tabindex=\"0\" aria-expanded=\"true\" aria-controls=\"e-n-accordion-item-1710\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> ewirexon SiC &amp; Compound Semiconductor Diamond Wire Cutting System <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-up\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M288.662 352H31.338c-17.818 0-26.741-21.543-14.142-34.142l128.662-128.662c7.81-7.81 20.474-7.81 28.284 0l128.662 128.662c12.6 12.599 3.676 34.142-14.142 34.142z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-down\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M31.3 192h257.3c17.8 0 26.7 21.5 14.1 34.1L174.1 354.8c-7.8 7.8-20.5 7.8-28.3 0L17.2 226.1C4.6 213.5 13.5 192 31.3 192z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1710\" class=\"elementor-element elementor-element-a8c8686 e-con-full e-flex e-con e-child\" data-id=\"a8c8686\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-8bb45d0 elementor-widget elementor-widget-text-editor\" data-id=\"8bb45d0\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<div><div><p>The new SiC &amp; Compound Semiconductor diamond wire cutting systems from ewirexon are specially developed for high-precision slicing of SiC ingots and wide-bandgap substrates, where ultra-high wafer yield and minimal surface damage are required. The new SiC Series achieves significantly higher material yield than competitor products in this application area. The use of our cutting systems enables savings in production costs for semiconductor fabs. Another positive side effect is the reduction of material waste and surface damage.<\/p><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1711\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"2\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1711\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> Benefits <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-up\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M288.662 352H31.338c-17.818 0-26.741-21.543-14.142-34.142l128.662-128.662c7.81-7.81 20.474-7.81 28.284 0l128.662 128.662c12.6 12.599 3.676 34.142-14.142 34.142z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-down\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M31.3 192h257.3c17.8 0 26.7 21.5 14.1 34.1L174.1 354.8c-7.8 7.8-20.5 7.8-28.3 0L17.2 226.1C4.6 213.5 13.5 192 31.3 192z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1711\" class=\"elementor-element elementor-element-a037296 e-con-full e-flex e-con e-child\" data-id=\"a037296\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-bd4dd51 elementor-widget elementor-widget-text-editor\" data-id=\"bd4dd51\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<div><div><ul><li>Potential savings in production costs through higher material yield of the cutting systems in typical SiC processing lines<\/li><li>Optimum use of resources<\/li><li>Material cost savings in production due to minimal kerf loss and sub-surface damage<\/li><li>Flexible and compact equipment design possible due to modular structure and small footprint<\/li><li>Easier handling during installation and maintenance thanks to user-friendly operation and remote monitoring<\/li><li>Reduction of maintenance costs through longer service life of the diamond wire and machine components<\/li><li>Economical turnkey system solutions thanks to customized process parameters and full system integration<\/li><\/ul><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1712\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"3\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1712\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> Applications <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-up\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M288.662 352H31.338c-17.818 0-26.741-21.543-14.142-34.142l128.662-128.662c7.81-7.81 20.474-7.81 28.284 0l128.662 128.662c12.6 12.599 3.676 34.142-14.142 34.142z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-down\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M31.3 192h257.3c17.8 0 26.7 21.5 14.1 34.1L174.1 354.8c-7.8 7.8-20.5 7.8-28.3 0L17.2 226.1C4.6 213.5 13.5 192 31.3 192z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1712\" class=\"elementor-element elementor-element-af2137b e-con-full e-flex e-con e-child\" data-id=\"af2137b\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0cc4e3f elementor-widget elementor-widget-text-editor\" data-id=\"0cc4e3f\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<div><div><ul><li>SiC &amp; Compound Semiconductor Processing<\/li><li>Power Semiconductor Wafer Manufacturing<\/li><li>Ingot Slicing &amp; Substrate Processing<\/li><li>Wide-Bandgap Material Cutting<\/li><li>R&amp;D Labs &amp; Pilot Production Lines<\/li><li>Advanced Packaging Facilities<\/li><\/ul><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t<details id=\"e-n-accordion-item-1713\" class=\"e-n-accordion-item\" >\n\t\t\t\t<summary class=\"e-n-accordion-item-title\" data-accordion-index=\"4\" tabindex=\"-1\" aria-expanded=\"false\" aria-controls=\"e-n-accordion-item-1713\" >\n\t\t\t\t\t<span class='e-n-accordion-item-title-header'><div class=\"e-n-accordion-item-title-text\"> Technical Data <\/div><\/span>\n\t\t\t\t\t\t\t<span class='e-n-accordion-item-title-icon'>\n\t\t\t<span class='e-opened' ><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-up\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M288.662 352H31.338c-17.818 0-26.741-21.543-14.142-34.142l128.662-128.662c7.81-7.81 20.474-7.81 28.284 0l128.662 128.662c12.6 12.599 3.676 34.142-14.142 34.142z\"><\/path><\/svg><\/span>\n\t\t\t<span class='e-closed'><svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-down\" viewBox=\"0 0 320 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M31.3 192h257.3c17.8 0 26.7 21.5 14.1 34.1L174.1 354.8c-7.8 7.8-20.5 7.8-28.3 0L17.2 226.1C4.6 213.5 13.5 192 31.3 192z\"><\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t<div role=\"region\" aria-labelledby=\"e-n-accordion-item-1713\" class=\"elementor-element elementor-element-d3f444f e-con-full e-flex e-con e-child\" data-id=\"d3f444f\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-935f0fb elementor-widget elementor-widget-text-editor\" data-id=\"935f0fb\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<table><colgroup> <col width=\"51\" \/> <col width=\"212\" \/> <col width=\"188\" \/><\/colgroup><tbody><tr><td>NO.<\/td><td>Parameter<\/td><td>Specification<\/td><\/tr><tr><td data-sheet-value=\"1\">1<\/td><td>Model<\/td><td>TCQF400LNC-FM-HL<\/td><\/tr><tr><td data-sheet-value=\"2\">2<\/td><td>Cutting Principle<\/td><td>Endless diamond wire \/ Physical cutting<\/td><\/tr><tr><td data-sheet-value=\"3\">3<\/td><td>Cutting Functions<\/td><td>Slicing \/ Angle &amp; Profile Cutting<\/td><\/tr><tr><td data-sheet-value=\"4\">4<\/td><td>Maximum Workpiece Size(mm)<\/td><td>\u03a6600mm, Height 500mm<\/td><\/tr><tr><td data-sheet-value=\"5\">5<\/td><td>Worktable Size(mm)<\/td><td>\u00d8380 \u8f6c\u53f0<\/td><\/tr><tr><td data-sheet-value=\"6\">6<\/td><td>Cutting Planarity Accuracy(mm)<\/td><td data-sheet-value=\"0.08\">0.08<\/td><\/tr><tr><td data-sheet-value=\"7\">7<\/td><td>Surface Roughness(\u03bcm)<\/td><td>Ra 0.8\u03bcm<\/td><\/tr><tr><td data-sheet-value=\"8\">8<\/td><td>Wire Specification(mm)<\/td><td>\u00d80.65\u20131.0\/2580<\/td><\/tr><tr><td data-sheet-value=\"9\">9<\/td><td>Tension System<\/td><td>Constant Wire Tension Control<\/td><\/tr><tr><td data-sheet-value=\"10\">10<\/td><td>Guide Wheel Quantity<\/td><td>4 wheels<\/td><\/tr><tr><td data-sheet-value=\"11\">11<\/td><td>Drive Motor<\/td><td>Servo motor<\/td><\/tr><tr><td data-sheet-value=\"12\">12<\/td><td>Wire Speed (m\/s)<\/td><td>51Max\uff08Adjustable\uff09<\/td><\/tr><tr><td data-sheet-value=\"13\">13<\/td><td>Total Power(kW)<\/td><td data-sheet-value=\"2.8\">2.8<\/td><\/tr><tr><td data-sheet-value=\"14\">14<\/td><td>Voltage<\/td><td>220v 50Hz<\/td><\/tr><tr><td data-sheet-value=\"15\">15<\/td><td>Control System<\/td><td>Custom-developed Tongcheng T32 system<\/td><\/tr><tr><td data-sheet-value=\"16\">16<\/td><td>Footprint (L\u00d7W\u00d7H)(mm)<\/td><td>1350\u00d71066\u00d71968<\/td><\/tr><tr><td data-sheet-value=\"17\">17<\/td><td>Gross Weight kg<\/td><td data-sheet-value=\"720\">720<\/td><\/tr><\/tbody><\/table>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-f277af6 elementor-widget__width-initial elementor-widget-mobile__width-inherit elementor-widget elementor-widget-image\" data-id=\"f277af6\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"image.default\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"1182\" height=\"2560\" src=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-scaled.png\" class=\"attachment-full size-full wp-image-990\" alt=\"\" srcset=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-scaled.png 1182w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-scaled-600x1299.png 600w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-139x300.png 139w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-473x1024.png 473w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-768x1663.png 768w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-709x1536.png 709w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-946x2048.png 946w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/05\/11-6x12.png 6w\" sizes=\"(max-width: 1182px) 100vw, 1182px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7898d75 e-flex e-con-boxed e-con e-parent\" data-id=\"7898d75\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-606b42a e-con-full e-flex e-con e-child\" data-id=\"606b42a\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-892533b elementor-widget elementor-widget-heading\" data-id=\"892533b\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Case Study: SiC &amp; Compound Semiconductor Processing<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e2941c9 elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"e2941c9\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"divider.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-03b3e45 elementor-widget elementor-widget-text-editor\" data-id=\"03b3e45\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"text-editor.default\">\n\t\t\t\t\t\t\t\t\t<div><div><p>This case study shows how the optimal selection of ewirexon diamond wire cutting systems can help boost wafer yield for SiC &amp; compound semiconductor processing by up to 15% and thus sustainably lower the production costs of power semiconductor fabs. In addition, ewirexon&#8217;s SiC slicing solution delivers minimal surface damage, reduced material waste and higher production throughput compared to conventional cutting methods.<\/p><div><div><p>Want to know more project cases? Feel free to write us!<\/p><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-47897e5 e-con-full e-flex e-con e-child\" data-id=\"47897e5\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-38d4813 e-con-full e-flex e-con e-parent\" data-id=\"38d4813\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t<div class=\"elementor-element elementor-element-196b547 elementor-widget elementor-widget-template\" data-id=\"196b547\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" 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type=\"file\" name=\"form_fields[field_6fe8f19]\" id=\"form-field-field_6fe8f19\" class=\"elementor-field elementor-size-sm  elementor-upload-field\">\n\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<div class=\"elementor-field-group elementor-column elementor-field-type-submit elementor-col-100 e-form__buttons\">\n\t\t\t\t\t<button class=\"elementor-button elementor-size-sm\" type=\"submit\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Submit Form<\/span>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/button>\n\t\t\t\t<\/div>\n\t\t\t<\/div>\n\t\t<\/form>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-2ea7c2d e-flex e-con-boxed e-con e-parent\" data-id=\"2ea7c2d\" data-element_type=\"container\" data-e-type=\"container\" data-settings=\"{&quot;background_background&quot;:&quot;classic&quot;,&quot;ekit_has_onepagescroll_dot&quot;:&quot;yes&quot;}\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ca6bff7 elementor-widget elementor-widget-heading\" data-id=\"ca6bff7\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"heading.default\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">News &amp; Updates<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-6451adb elementor-widget-divider--view-line elementor-widget elementor-widget-divider\" data-id=\"6451adb\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"divider.default\">\n\t\t\t\t\t\t\t<div class=\"elementor-divider\">\n\t\t\t<span class=\"elementor-divider-separator\">\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-84fa85d elementor-grid-3 elementor-grid-tablet-2 elementor-grid-mobile-1 elementor-posts--thumbnail-top elementor-widget elementor-widget-posts\" data-id=\"84fa85d\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;classic_row_gap&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:40,&quot;sizes&quot;:[]},&quot;classic_columns&quot;:&quot;3&quot;,&quot;classic_columns_tablet&quot;:&quot;2&quot;,&quot;classic_columns_mobile&quot;:&quot;1&quot;,&quot;classic_row_gap_laptop&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;classic_row_gap_tablet&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;classic_row_gap_mobile&quot;:{&quot;unit&quot;:&quot;px&quot;,&quot;size&quot;:&quot;&quot;,&quot;sizes&quot;:[]},&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"posts.classic\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-posts-container elementor-posts elementor-posts--skin-classic elementor-grid\" role=\"list\">\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-894 post type-post status-publish format-standard has-post-thumbnail hentry category-company-news category-market-events\" role=\"listitem\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/ewirexon.com\/de\/join-us-at-cioe-2026-in-shenzhen-precision-diamond-wire-cutting-solutions-for-advanced-hard-brittle-materials\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img decoding=\"async\" width=\"783\" height=\"391\" src=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c27\u5c4a\u4e2d\u56fd\u56fd\u9645\u5149\u7535\u535a\u89c8\u4f1a.jpeg\" class=\"attachment-full size-full wp-image-1349\" alt=\"\" srcset=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c27\u5c4a\u4e2d\u56fd\u56fd\u9645\u5149\u7535\u535a\u89c8\u4f1a.jpeg 783w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c27\u5c4a\u4e2d\u56fd\u56fd\u9645\u5149\u7535\u535a\u89c8\u4f1a-600x300.jpeg 600w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c27\u5c4a\u4e2d\u56fd\u56fd\u9645\u5149\u7535\u535a\u89c8\u4f1a-300x150.jpeg 300w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c27\u5c4a\u4e2d\u56fd\u56fd\u9645\u5149\u7535\u535a\u89c8\u4f1a-768x384.jpeg 768w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c27\u5c4a\u4e2d\u56fd\u56fd\u9645\u5149\u7535\u535a\u89c8\u4f1a-18x9.jpeg 18w\" sizes=\"(max-width: 783px) 100vw, 783px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/ewirexon.com\/de\/join-us-at-cioe-2026-in-shenzhen-precision-diamond-wire-cutting-solutions-for-advanced-hard-brittle-materials\/\" >\n\t\t\t\tJoin Us at CIOE 2026 in Shenzhen \u2013 Precision Diamond Wire Cutting Solutions for Advanced Hard &amp; Brittle Materials\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__meta-data\">\n\t\t\t\t\t<span class=\"elementor-post-date\">\n\t\t\tSeptember 1, 2026\t\t<\/span>\n\t\t\t\t<span class=\"elementor-post-avatar\">\n\t\t\tKeine Kommentare\t\t<\/span>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>We are pleased to announce that\u00a0ewirexon, a professional manufacturer of precision diamond wire cutting machines, will participate in\u00a0CIOE 2026 (27th China International Optoelectronic Exposition)\u00a0alongside the<\/p>\n\t\t<\/div>\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/ewirexon.com\/de\/join-us-at-cioe-2026-in-shenzhen-precision-diamond-wire-cutting-solutions-for-advanced-hard-brittle-materials\/\" aria-label=\"Read more about Join Us at CIOE 2026 in Shenzhen \u2013 Precision Diamond Wire Cutting Solutions for Advanced Hard &amp; Brittle Materials\" tabindex=\"-1\" >\n\t\t\tLearn More \u00bb\t\t<\/a>\n\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-937 post type-post status-publish format-standard has-post-thumbnail hentry category-company-news\" role=\"listitem\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/ewirexon.com\/de\/precision-cutting-for-hard-materials-ewirexon-debuts-at-pm-china-2026-booth-l095\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img decoding=\"async\" width=\"789\" height=\"444\" src=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c18\u5c4a\u51b6\u91d1.png\" class=\"attachment-full size-full wp-image-1348\" alt=\"\" srcset=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c18\u5c4a\u51b6\u91d1.png 789w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c18\u5c4a\u51b6\u91d1-600x338.png 600w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c18\u5c4a\u51b6\u91d1-300x169.png 300w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c18\u5c4a\u51b6\u91d1-768x432.png 768w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u7b2c18\u5c4a\u51b6\u91d1-18x10.png 18w\" sizes=\"(max-width: 789px) 100vw, 789px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/ewirexon.com\/de\/precision-cutting-for-hard-materials-ewirexon-debuts-at-pm-china-2026-booth-l095\/\" >\n\t\t\t\tPrecision Cutting for Hard Materials: ewirexon Debuts at PM CHINA 2026 (Booth L095)\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__meta-data\">\n\t\t\t\t\t<span class=\"elementor-post-date\">\n\t\t\tFebruar 24, 2026\t\t<\/span>\n\t\t\t\t<span class=\"elementor-post-avatar\">\n\t\t\tKeine Kommentare\t\t<\/span>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>The global hard material processing industry is converging in Shanghai, and ewirexon \u2014 the precision cutting brand of Shanghai Tongcheng Industrial Co., Ltd. \u2014 is<\/p>\n\t\t<\/div>\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/ewirexon.com\/de\/precision-cutting-for-hard-materials-ewirexon-debuts-at-pm-china-2026-booth-l095\/\" aria-label=\"Read more about Precision Cutting for Hard Materials: ewirexon Debuts at PM CHINA 2026 (Booth L095)\" tabindex=\"-1\" >\n\t\t\tLearn More \u00bb\t\t<\/a>\n\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<article class=\"elementor-post elementor-grid-item post-935 post type-post status-publish format-standard has-post-thumbnail hentry category-company-news\" role=\"listitem\">\n\t\t\t\t<a class=\"elementor-post__thumbnail__link\" href=\"https:\/\/ewirexon.com\/de\/engineered-for-precision-built-for-your-success-visit-ewirexon-at-laser-world-of-photonics-china-2026-e4-4359\/\" tabindex=\"-1\" >\n\t\t\t<div class=\"elementor-post__thumbnail\"><img loading=\"lazy\" decoding=\"async\" width=\"739\" height=\"415\" src=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u5149\u5b50\u6fc0\u5149.jpeg\" class=\"attachment-full size-full wp-image-1347\" alt=\"\" srcset=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u5149\u5b50\u6fc0\u5149.jpeg 739w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u5149\u5b50\u6fc0\u5149-600x337.jpeg 600w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u5149\u5b50\u6fc0\u5149-300x168.jpeg 300w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/\u5149\u5b50\u6fc0\u5149-18x10.jpeg 18w\" sizes=\"(max-width: 739px) 100vw, 739px\" \/><\/div>\n\t\t<\/a>\n\t\t\t\t<div class=\"elementor-post__text\">\n\t\t\t\t<h3 class=\"elementor-post__title\">\n\t\t\t<a href=\"https:\/\/ewirexon.com\/de\/engineered-for-precision-built-for-your-success-visit-ewirexon-at-laser-world-of-photonics-china-2026-e4-4359\/\" >\n\t\t\t\tEngineered for Precision. Built for Your Success \u2013 Visit ewirexon at LASER WORLD OF PHOTONICS CHINA 2026 (E4.4359)\t\t\t<\/a>\n\t\t<\/h3>\n\t\t\t\t<div class=\"elementor-post__meta-data\">\n\t\t\t\t\t<span class=\"elementor-post-date\">\n\t\t\tFebruar 18, 2026\t\t<\/span>\n\t\t\t\t<span class=\"elementor-post-avatar\">\n\t\t\tKeine Kommentare\t\t<\/span>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-post__excerpt\">\n\t\t\t<p>Exciting news! Our team is ready to welcome you at&nbsp;LASER WORLD OF PHOTONICS CHINA 2026, taking place March 18-20, 2026 at the Shanghai New International<\/p>\n\t\t<\/div>\n\t\t\n\t\t<a class=\"elementor-post__read-more\" href=\"https:\/\/ewirexon.com\/de\/engineered-for-precision-built-for-your-success-visit-ewirexon-at-laser-world-of-photonics-china-2026-e4-4359\/\" aria-label=\"Read more about Engineered for Precision. Built for Your Success \u2013 Visit ewirexon at LASER WORLD OF PHOTONICS CHINA 2026 (E4.4359)\" tabindex=\"-1\" >\n\t\t\tLearn More \u00bb\t\t<\/a>\n\n\t\t\t\t<\/div>\n\t\t\t\t<\/article>\n\t\t\t\t<\/div>\n\t\t\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-492d505 elementor-align-center elementor-widget elementor-widget-button\" data-id=\"492d505\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;ekit_we_effect_on&quot;:&quot;none&quot;}\" data-widget_type=\"button.default\">\n\t\t\t\t\t\t\t\t\t\t<a class=\"elementor-button elementor-button-link elementor-size-sm\" href=\"#\">\n\t\t\t\t\t\t<span class=\"elementor-button-content-wrapper\">\n\t\t\t\t\t\t<span class=\"elementor-button-icon\">\n\t\t\t\t<svg aria-hidden=\"true\" class=\"e-font-icon-svg e-fas-caret-right\" viewBox=\"0 0 192 512\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\"><path d=\"M0 384.662V127.338c0-17.818 21.543-26.741 34.142-14.142l128.662 128.662c7.81 7.81 7.81 20.474 0 28.284L34.142 398.804C21.543 411.404 0 402.48 0 384.662z\"><\/path><\/svg>\t\t\t<\/span>\n\t\t\t\t\t\t\t\t\t<span class=\"elementor-button-text\">Read More About Our Service Solutions<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"<p>High-precision Diamond Wire Cutting Systems for Substrate Slicing SiC ingots, compound semiconductor substrates and wide-bandgap materials experience significant mechanical stress and thermal impact during high-speed slicing. To ensure excellent surface quality, minimal sub-surface damage and avoid chipping or micro-cracks that lead to device failure, semiconductor manufacturers require highly stable cutting processes and precise process control. [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":331,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-432","page","type-page","status-publish","hentry"],"acf":[],"_hostinger_reach_plugin_has_subscription_block":false,"_hostinger_reach_plugin_is_elementor":false,"_links":{"self":[{"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/pages\/432","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/comments?post=432"}],"version-history":[{"count":31,"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/pages\/432\/revisions"}],"predecessor-version":[{"id":1726,"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/pages\/432\/revisions\/1726"}],"up":[{"embeddable":true,"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/pages\/331"}],"wp:attachment":[{"href":"https:\/\/ewirexon.com\/de\/wp-json\/wp\/v2\/media?parent=432"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}