{"id":2252,"date":"2026-09-24T09:02:13","date_gmt":"2026-09-24T09:02:13","guid":{"rendered":"https:\/\/ewirexon.com\/optical-glass-cutting-co-packaged-optics-diamond-wire-saw\/"},"modified":"2026-09-24T09:06:55","modified_gmt":"2026-09-24T09:06:55","slug":"optical-glass-cutting-co-packaged-optics-diamond-wire-saw","status":"publish","type":"post","link":"https:\/\/ewirexon.com\/es\/optical-glass-cutting-co-packaged-optics-diamond-wire-saw\/","title":{"rendered":"Optical Glass Cutting for Co-Packaged Optics: Where Diamond Wire Saw Fits"},"content":{"rendered":"<!-- SEO Title: Optical Glass Cutting for CPO: Diamond Wire Saw Guide -->\n<!-- Meta Description: See where diamond wire saw cutting fits in co-packaged optics, from glass and quartz blank preparation to edge quality and supplier qualification. -->\n<!-- Suggested URL Slug: optical-glass-cutting-co-packaged-optics-diamond-wire-saw -->\n\n<p>Co-packaged optics is moving from architecture diagrams into manufacturing programs. In 2026, GlobalFoundries introduced its SCALE optical-module platform, Coherent demonstrated multiple CPO technologies at OFC, and Corning described fiber-to-chip connectivity as a system-level manufacturing challenge. These developments reflect the same pressure: AI clusters need more bandwidth without allowing electrical interconnect power and loss to grow unchecked.<\/p>\n\n<p>That trend creates work for glass, quartz, sapphire, silicon and ceramic processing suppliers, but it is easy to overstate where a <a href=\"https:\/\/ewirexon.com\/es\/diamond-wire-saw-landing-page\/\">sierra de hilo de diamante<\/a> fits. A wire saw can prepare blanks, coupons, plates, windows, interposer precursors and precision edges. It does not fabricate nanometer-scale waveguides, drill through-glass vias, deposit redistribution layers, align fibers or replace final optical polishing.<\/p>\n\n<p>This guide defines the useful boundary. It shows how optical glass cutting can support CPO and silicon-photonics development, which quality outputs matter, and what engineers and buyers should put into a cutting-equipment qualification.<\/p>\n\n\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1672\" height=\"941\" src=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured.png\" alt=\"A transparent fused-silica block undergoing precision diamond wire cutting beside optical glass and quartz coupons\" class=\"wp-image-2249\" title=\"\" srcset=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured.png 1672w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured-300x169.png 300w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured-1024x576.png 1024w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured-768x432.png 768w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured-1536x864.png 1536w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured-18x10.png 18w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-optical-glass-cutting-featured-600x338.png 600w\" sizes=\"(max-width: 1672px) 100vw, 1672px\" \/><figcaption class=\"wp-element-caption\">Conceptual optical-glass and quartz blank preparation for photonics package development. The illustration is not a customer installation.<\/figcaption><\/figure>\n\n\n<h2>Why co-packaged optics changes material preparation<\/h2>\n\n<p>Traditional pluggable optics place the optical module at a system faceplate. CPO moves optical engines much closer to a switch ASIC or compute device. Shorter electrical paths can reduce loss and power, but the package must combine optical, electrical, thermal and mechanical functions in a much smaller volume.<\/p>\n\n<p>A 2026 <em>Nature Electronics<\/em> review describes a roadmap spanning 2D integration, 2.5D interposer-based integration and 3D heterogeneous stacking. The exact material stack varies by architecture. Possible hard and brittle components include:<\/p>\n\n<ul>\n<li>fused silica or optical-glass blanks for passive optical structures and fixtures;<\/li>\n<li>glass-core or glass-interposer development coupons;<\/li>\n<li>quartz components used in optical or process environments;<\/li>\n<li>sapphire windows or carriers in selected optical assemblies;<\/li>\n<li>silicon, SiC or ceramic pieces used for thermal, mechanical or photonic functions;<\/li>\n<li>coated filter, cover or reference components.<\/li>\n<\/ul>\n\n<p>Not every CPO platform uses every material. The cutting supplier should work from a drawing and stack definition, not assume that &#8220;CPO glass&#8221; is one standardized product.<\/p>\n\n<h2>Where diamond wire saw cutting fits, and where it does not<\/h2>\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" width=\"1672\" height=\"941\" src=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary.png\" alt=\"Process flow from raw optical glass through wire cutting, finishing, microfabrication and optical package assembly\" class=\"wp-image-2250\" title=\"\" srcset=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary.png 1672w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary-300x169.png 300w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary-1024x576.png 1024w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary-768x432.png 768w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary-1536x864.png 1536w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary-18x10.png 18w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/cpo-diamond-wire-process-boundary-600x338.png 600w\" sizes=\"(max-width: 1672px) 100vw, 1672px\" \/><figcaption class=\"wp-element-caption\">Diamond wire cutting prepares blanks; finishing, microfabrication and assembly remain separate downstream processes.<\/figcaption><\/figure>\n\n\n<table>\n<thead><tr><th>Manufacturing task<\/th><th>Diamond wire saw fit<\/th><th>Reason<\/th><\/tr><\/thead>\n<tbody>\n<tr><td>Cutting a boule, block or thick plate into blanks<\/td><td>Strong fit<\/td><td>Narrow kerf and low-force mechanical separation<\/td><\/tr>\n<tr><td>Preparing R&amp;D coupons from expensive glass or quartz<\/td><td>Strong fit<\/td><td>Flexible size, orientation and small-batch control<\/td><\/tr>\n<tr><td>Parallel slicing of repeated plates<\/td><td>Potential fit<\/td><td>Multi-wire productivity when pitch and handling are qualified<\/td><\/tr>\n<tr><td>Angle cuts, slots or special profiles<\/td><td>Application dependent<\/td><td>Requires machine motion, fixture and wire-access review<\/td><\/tr>\n<tr><td>Separating a coated optical stack<\/td><td>Application dependent<\/td><td>Coating adhesion, coolant and support must be tested<\/td><\/tr>\n<tr><td>Final optical surface generation<\/td><td>Not a replacement<\/td><td>Grinding, lapping and polishing still establish optical finish<\/td><\/tr>\n<tr><td>Waveguide or grating fabrication<\/td><td>Not suitable<\/td><td>Requires lithography, etching, deposition or precision laser processes<\/td><\/tr>\n<tr><td>TGV drilling and metallization<\/td><td>Not suitable<\/td><td>Separate via-formation, cleaning, seed and plating processes are required<\/td><\/tr>\n<tr><td>Fiber attach and optical alignment<\/td><td>Not suitable<\/td><td>Requires active\/passive alignment and bonding equipment<\/td><\/tr>\n<\/tbody>\n<\/table>\n\n<p>This boundary is commercially useful. It prevents a factory from buying a machine for the wrong process while identifying upstream operations where material yield and edge integrity can be improved.<\/p>\n\n<h2>Why optical glass and quartz are difficult to cut<\/h2>\n\n<p>Optical glasses are brittle and can contain residual stress from melting, molding, ion exchange, coating or bonding. Fused silica has low thermal expansion but high hardness and a fracture-sensitive surface. Crystalline quartz adds directional behavior that amorphous fused silica does not have. Sapphire is harder again and anisotropic. These materials should not share one recipe simply because they are transparent.<\/p>\n\n<p>A fixed-abrasive diamond wire removes material through many small contacts. If grain penetration is controlled, cutting force and kerf can remain low. If the wire rubs, vibrates or carries debris through the kerf, the part can develop:<\/p>\n\n<ul>\n<li>entry and exit chips that consume the usable edge zone;<\/li>\n<li>subsurface cracks that open during polishing or thermal cycling;<\/li>\n<li>waviness that requires excessive stock removal;<\/li>\n<li>corner breakage during unloading;<\/li>\n<li>coating delamination or fluid attack;<\/li>\n<li>particulate or ionic contamination incompatible with the next step.<\/li>\n<\/ul>\n\n<p>The correct optimization target is an accepted blank after finishing, not the fastest separation time.<\/p>\n\n<h2>Quality outputs that matter for CPO component preparation<\/h2>\n\n<h3>Edge chips and exclusion zone<\/h3>\n\n<p>Define chip size, frequency and distance from the functional area. A generic &#8220;no visible chips&#8221; requirement is not measurable. Use magnification, lighting and defect classes agreed before the trial. If the edge will be bonded or aligned, include the relevant datum region.<\/p>\n\n<h3>Subsurface damage and finishing allowance<\/h3>\n\n<p>Surface roughness alone does not show crack depth. Establish the amount removed by grinding or polishing before strength and optical requirements stabilize. Destructive cross-sectioning, controlled etching or other validated methods can be used on sampled parts.<\/p>\n\n<h3>Flatness, wedge and angle<\/h3>\n\n<p>A CPO fixture, optical bench or interposer precursor may require parallel faces or a controlled angle. Measure the full surface and preserve the wire-travel direction. Average thickness cannot reveal wedge, bow or periodic waviness.<\/p>\n\n<h3>Contamination and cleanability<\/h3>\n\n<p>Document coolant chemistry, corrosion inhibitors, biocides, filter media, machine materials and cleaning sequence. A cut can be geometrically acceptable and still be unusable if residues interfere with coating, bonding or lithography. Confirm cleanliness with the downstream owner rather than assigning a generic cleanroom label.<\/p>\n\n<h3>Coating integrity<\/h3>\n\n<p>If the material is already coated, inspect adhesion, edge lift, scratches and chemical compatibility. A protective film or sacrificial support may reduce damage, but it can also trap particles or change coolant access. Coated and uncoated results should not be mixed.<\/p>\n\n<h2>How to develop a stable optical glass cutting process<\/h2>\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" width=\"1672\" height=\"941\" src=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks.png\" alt=\"Optical glass acceptance checks covering kerf, edge chips, subsurface damage, flatness, coating and cleanliness\" class=\"wp-image-2251\" title=\"\" srcset=\"https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks.png 1672w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks-300x169.png 300w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks-1024x576.png 1024w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks-768x432.png 768w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks-1536x864.png 1536w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks-18x10.png 18w, https:\/\/ewirexon.com\/wp-content\/uploads\/2026\/09\/optical-glass-cutting-quality-checks-600x338.png 600w\" sizes=\"(max-width: 1672px) 100vw, 1672px\" \/><figcaption class=\"wp-element-caption\">Kerf alone is not acceptance; edge chips, subsurface damage, flatness, coating integrity and cleanliness also matter.<\/figcaption><\/figure>\n\n\n<h3>Start with the material certificate and stress state<\/h3>\n\n<p>Record glass type, supplier lot, annealing condition, dimensions, coating and bonded layers. Use polariscopic stress inspection where relevant. Residual stress can make two visually identical blanks fracture differently.<\/p>\n\n<h3>Choose the wire for total stock loss<\/h3>\n\n<p>Wire diameter and abrasive envelope influence geometric kerf. Grit size, protrusion and density influence removal capacity and damage. A fine wire that bends or loads can create more finishing loss than a slightly larger stable wire. Use the <a href=\"https:\/\/ewirexon.com\/es\/diamond-wire-selection-diameter-grit-size-bond-cutting-results\/\">diamond wire selection framework<\/a> to compare kerf, finish and life together.<\/p>\n\n<h3>Design support around the last millimeter<\/h3>\n\n<p>The exit edge is often the highest-risk zone. A sacrificial plate or full-area bond can support the final ligament. Verify adhesive stiffness, cure, removal chemistry and thermal expansion. For thin pieces, handling tooling belongs in the process qualification because unloading can create defects blamed on cutting.<\/p>\n\n<h3>Tune speed and feed by contact length<\/h3>\n\n<p>A constant feed command does not create constant load when contact length changes. Monitor motor current or cutting power, tension response and wire bow. Reduce feed where force rises or edge support weakens, then evaluate cycle-time recovery in easier zones. Do not optimize on a single intact part.<\/p>\n\n<h3>Control coolant and particles<\/h3>\n\n<p>Verify actual flow at the kerf, filter differential pressure, fluid temperature and solids loading. Excessive jets can disturb a fine wire or delicate part; insufficient flow allows recutting. The <a href=\"https:\/\/ewirexon.com\/es\/diamond-wire-saw-coolant-debris-removal-yield\/\">coolant and debris-removal guide<\/a> provides a practical control plan.<\/p>\n\n<h2>Endless diamond wire saw versus diamond multi-wire saw<\/h2>\n\n<p>An endless diamond wire saw is usually the better development platform for new CPO materials, optical coupons, small batches, angle studies and special profiles. It provides flexible workholding and a defined wire loop for experiments. A <a href=\"https:\/\/ewirexon.com\/es\/products\/precision-optical-wafer-processing\/\">sierra de hilo de diamante de bucle infinito de sobremesa<\/a> can be useful when samples are small and the objective is material screening rather than production throughput.<\/p>\n\n<p>A diamond multi-wire saw becomes relevant for repeated parallel plates or wafers. It can improve throughput and material utilization, but adds web-pitch, lane-tension, guide-groove, coolant-distribution and unloading risks. The process should be requalified across the web, with each part linked to its lane position.<\/p>\n\n<p>For either architecture, ask whether the fixture, wire path, minimum part thickness and coolant system have been demonstrated on the actual material stack. A nominal cutting envelope is not evidence of edge quality.<\/p>\n\n<h2>A qualification route for CPO and optical components<\/h2>\n\n<ol>\n<li><strong>Define the component boundary.<\/strong> Supply the drawing, material trade name, orientation, coatings, bonded layers and functional edge zones.<\/li>\n<li><strong>Agree on downstream inputs.<\/strong> Record the grinding, polishing, cleaning, coating or bonding process that follows cutting.<\/li>\n<li><strong>Cut uncoated coupons first.<\/strong> Establish wire, fixture, coolant and speed-feed behavior without risking expensive functional layers.<\/li>\n<li><strong>Map defects spatially.<\/strong> Link chips, profile error and surface marks to entry, maximum contact, exit and wire direction.<\/li>\n<li><strong>Add the real stack.<\/strong> Repeat with coatings, adhesives or bonded layers and verify chemical compatibility.<\/li>\n<li><strong>Run finishing validation.<\/strong> Measure stock removal, final strength, edge quality and cleanability.<\/li>\n<li><strong>Test repeatability.<\/strong> Include multiple lots, wire-life stages, operators, planned stops and cleaning cycles.<\/li>\n<li><strong>Release on accepted cost.<\/strong> Calculate material yield, consumables, labor, finishing removal and rejected components.<\/li>\n<\/ol>\n\n<h2>Procurement questions for an optical glass cutting machine<\/h2>\n\n<ul>\n<li>Which exact glass, quartz, sapphire or bonded stack has the supplier cut?<\/li>\n<li>What kerf, chip, waviness and subsurface-damage methods were used?<\/li>\n<li>How are angle, wedge, flatness and datum repeatability measured?<\/li>\n<li>Can machine data be exported and synchronized with part position?<\/li>\n<li>How are fixtures and unloading tools adapted for thin brittle components?<\/li>\n<li>Which coolant and cleaning chemicals contact the part?<\/li>\n<li>Can the factory test include coated parts and aged wire?<\/li>\n<li>What process-development support is included after installation?<\/li>\n<\/ul>\n\n<h2>How ewirexon supports optical and quartz cutting<\/h2>\n\n<p>Ewirexon develops endless diamond wire saw, diamond multi-wire saw and desktop systems for quartz crystal, optical glass, sapphire, ceramics and semiconductor materials. Relevant application areas include <a href=\"https:\/\/ewirexon.com\/es\/quartz-crystal-optical-glass-slicing-diamond-wire-saw\/\">Corte de cristales de cuarzo y vidrio \u00f3ptico<\/a>, <a href=\"https:\/\/ewirexon.com\/es\/products\/precision-optical-wafer-processing\/\">precision optical wafer processing<\/a> y <a href=\"https:\/\/ewirexon.com\/es\/products\/high-precision-base-material-cutting\/\">high-precision base-material cutting<\/a>.<\/p>\n\n<p>For a CPO-related project, the useful first step is to review the real component drawing, material stack, coating status, target edge quality, finishing allowance and expected volume. Ewirexon&#8217;s <a href=\"https:\/\/ewirexon.com\/es\/process-parameter-consulting\/\">process consulting<\/a> y <a href=\"https:\/\/ewirexon.com\/es\/customized-equipment-development\/\">custom equipment development<\/a> can then be assessed against a trial plan. Applications outside the wire-saw process boundary should remain assigned to the appropriate lithography, via, polishing or alignment equipment.<\/p>\n\n<h2>Conclusi\u00f3n<\/h2>\n\n<p>Co-packaged optics is creating new combinations of photonic, packaging and thermal materials. That does not make every manufacturing step a wire-saw application. The diamond wire saw adds value where hard brittle blocks, plates and special components need low-force, narrow-kerf separation with controlled edges and stock allowance.<\/p>\n\n<p>The best equipment decision begins by defining where cutting ends and the optical process begins. Qualify the actual material stack, measure edge and subsurface damage, validate downstream finishing, and compare cost per accepted component. This disciplined boundary gives engineers useful process data and protects buyers from both under-specified and over-promised equipment.<\/p>\n\n<h2>Frequently asked questions<\/h2>\n\n<h3>What is co-packaged optics?<\/h3>\n<p>CPO places optical engines close to a switch ASIC or compute device in the same package or substrate environment. The goal is to reduce long high-speed electrical paths and improve bandwidth density and energy efficiency.<\/p>\n\n<h3>Can a diamond wire saw manufacture optical waveguides?<\/h3>\n<p>No. It can prepare glass, quartz or other hard brittle blanks and edges. Waveguides and gratings require processes such as lithography, etching, deposition, ion exchange, laser writing or molding.<\/p>\n\n<h3>Why use a diamond wire saw for optical glass cutting?<\/h3>\n<p>Fixed-abrasive wire cutting can provide low force, narrow kerf and flexible geometry for blanking, coupon preparation and slicing. The benefit must be verified through edge quality, subsurface damage and downstream finishing yield.<\/p>\n\n<h3>Can coated optical glass be wire cut?<\/h3>\n<p>Sometimes, but coating adhesion, coolant compatibility, support and particle control must be tested. A successful uncoated-glass cut does not prove a coated stack will pass.<\/p>\n\n<h3>Should CPO component production use an endless or multi-wire saw?<\/h3>\n<p>Use an endless diamond wire saw for development, special shapes and small batches. Consider a diamond multi-wire saw for repeated parallel components after lane consistency, coolant access and handling are qualified.<\/p>\n\n<h2>Referencias t\u00e9cnicas<\/h2>\n\n<ul>\n<li><a href=\"https:\/\/gf.com\/news-and-events\/news\/globalfoundries-accelerates-adoption-of-co-packaged-optics-for-advanced-ai-data-centers-with-scale-optical-module-solution\/\" rel=\"nofollow noopener\" target=\"_blank\">GlobalFoundries SCALE optical module solution, May 2026<\/a>.<\/li>\n<li><a href=\"https:\/\/www.coherent.com\/news\/press-releases\/coherent-co-packaged-optics-cpo-technologies-ofc-2026\" rel=\"nofollow noopener\" target=\"_blank\">Coherent CPO technology demonstrations at OFC 2026<\/a>.<\/li>\n<li><a href=\"https:\/\/www.corning.com\/optical-communications\/worldwide\/en\/home\/the-signal-network-blog\/why-scalable-cpo-must-be-built-as-a-system.html\" rel=\"nofollow noopener\" target=\"_blank\">Corning, why scalable CPO must be built as a system, July 2026<\/a>.<\/li>\n<li><a href=\"https:\/\/doi.org\/10.1038\/s41928-026-01681-6\" rel=\"nofollow noopener\" target=\"_blank\">Co-packaged optics for high-performance computing and artificial intelligence<\/a>.<\/li>\n<\/ul>\n\n<p><em>Editorial note: Industry announcements are linked and dated. The manufacturing boundaries described here are process guidance, not a claim that every CPO architecture uses the same material stack. The figures are AI-generated engineering illustrations, not customer installations or certified process drawings.<\/em><\/p>","protected":false},"excerpt":{"rendered":"<p>Co-packaged optics is moving from architecture diagrams into manufacturing programs. In 2026, GlobalFoundries introduced its SCALE optical-module platform, Coherent demonstrated multiple CPO technologies at OFC, and Corning described fiber-to-chip connectivity as a system-level manufacturing challenge. These developments reflect the same pressure: AI clusters need more bandwidth without allowing electrical interconnect power and loss to grow [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":2249,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[28],"tags":[64,77,41,36,42,65,39,78,54,40,53,44],"class_list":["post-2252","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-product-technology-updates","tag-advanced-packaging","tag-co-packaged-optics","tag-diamond-multi-wire-saw","tag-diamond-wire-saw","tag-endless-diamond-wire-saw","tag-glass-cutting","tag-hard-brittle-material-cutting","tag-optical-component-cutting","tag-optical-glass-slicing","tag-precision-diamond-wire-saw","tag-quartz-crystal-slicing","tag-semiconductor-wafer-cutting"],"acf":[],"_links":{"self":[{"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/posts\/2252","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/comments?post=2252"}],"version-history":[{"count":1,"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/posts\/2252\/revisions"}],"predecessor-version":[{"id":2253,"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/posts\/2252\/revisions\/2253"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/media\/2249"}],"wp:attachment":[{"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/media?parent=2252"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/categories?post=2252"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ewirexon.com\/es\/wp-json\/wp\/v2\/tags?post=2252"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}