경질 및 취성 재료용 정밀 다이아몬드 와이어 절단 시스템
Precision diamond wire cutting systems for quartz, graphite, glass, ceramics, sapphire, semiconductor materials, selected metals, stone, concrete and advanced industrial materials.
Low-Damage Cutting
Reduce kerf loss, chipping and surface damage when cutting quartz, graphite, glass, ceramics, sapphire and other hard brittle materials.
Custom Machine Selection
Tailored equipment for your specific material and process needs
Factory-Direct Price, Engineering Support.
Get competitive pricing from a factory with installation guidance and technical training support.
Choose the Right Diamond Wire Cutting Machine
From laboratory research to industrial mass production, ewirexon provides different diamond wire saw systems for various materials, sizes, accuracy levels and production requirements.
Endless Diamond Wire Saw
당사의 엔드리스 다이아몬드 와이어 쏘는 매우 안정적인 주행 정밀도와 낮은 커프 손실, 뛰어난 표면 절단 마감이 특징입니다.
Diamond Multi-Wire Saw
당사의 다이아몬드 멀티 와이어 톱은 높은 양산 효율과 뛰어난 수율, 초저 TTV 제어 성능이 특징입니다.
데스크톱형 무한 루프 다이아몬드 와이어 톱
Desktop endless loop diamond wire saws from our company feature compact tabletop design, high-precision hard brittle material cutting and smooth edge finish for laboratory research and small batch processing.
What Material Do You Need to Cut?
Different materials require different wire specifications, tension control, feed speed, fixture design and cooling methods. Send us your material details and we will recommend a suitable cutting solution.
Glass
Ceramics
SiC Wafer
Photovoltaic Wafer
New Material
Brittle Electronic Plate
Magnetic Material
Quartz Crystal
Application Solutions for High-End Manufacturing
Ewirexon diamond wire cutting systems are applied across advanced manufacturing industries where cutting accuracy, material yield and process stability directly affect production results.
Semiconductor Cutting Solutions
- 실리콘 웨이퍼 절단 솔루션
- SiC & Compound Semiconductor Cutting
- 마이크로전자 부품 정밀 절단
- 칩 캐리어 및 패키지 재료 절단
Ceramic Material Cutting Solutions
- 질화알루미늄 기판 절단
- 지르코니아 세라믹 부품 절단
- 전자용 세라믹 기판 절단
- 세라믹 절단용 다이아몬드 와이어 톱
Optics Cutting Solutions
- 사파이어 기판 절단 솔루션
- 석영 크리스탈 및 광학 유리 슬라이싱
- 적외선 광학 부품 절단
- 정밀 광학 웨이퍼 처리
PV Energy Cutting Solutions
- 모노/폴리 실리콘 잉곳 절단
- PV 웨이퍼 절단 솔루션
- 새로운 에너지 배터리 소재 절단
- 태양광 모듈 보조 재료 가공
Glass & Substrate Cutting Solutions
- 얇은 유리 패널 프로파일 커팅
- PCB 기판 소재 절단
- 취성 전자 플레이트 정밀 가공
- 고정밀 기초 소재 절단
Advanced Material Cutting Solutions
- Graphite & Carbon Material Cutting
- 자기 재료 및 특수 크리스탈 슬라이싱
- 불규칙한 형상의 고경도 공작물 가공
- 신규 유형 기능성 소재 가공
Services Support Beyond the Machine
Buying the right machine is only the first step. ewirexon supports customers with installation, parameter consulting, customized equipment development and professional technical training.
Why Choose Ewirexon
Lower Cutting Damage, Less Material Loss
Ewirexon specializes in high-efficiency diamond wire cutting systems for hard and brittle materials, helping customers reduce kerf loss, edge chipping and surface damage.
Integrated R&D and Manufacturing in China
With core operation and research facilities in China, ewirexon supports equipment development, precision manufacturing, testing and delivery from one integrated supply system.
Custom Solutions & Services Support
Machine structure, worktable, wire path, fixture and cutting parameters can be matched to your material and process.
Reliable China Supplier, Lower Purchase Risk
Serving 150+ professional clients worldwide with 40%+ export business, ewirexon combines factory-direct supply, quality standards and international technical support.
품질 인증
Ewirexon, a professional diamond wire saw manufacturer, holds ISO 9001, CE certificates to meet safety and compliance requirements for global government and projects.
A Real Team Behind Your Cutting Project
Ewirexon is supported by experienced engineers, production specialists and international sales staff who understand precision diamond wire cutting applications.
Founder & CEO
Sales Manage
공정 최적화 엔지니어
R&D Engineer
선임 애플리케이션 엔지니어
After-sales Engineer
Whether you need a lab machine, production cutting system or customized equipment, our team helps review your material requirements, recommend suitable configurations and support your project from inquiry to delivery.
Get Your Diamond Wire Saw Proposal in 4 Steps
Step 1
Send your material type, size and cutting requirement.
Step 2
Our engineer reviews your application and machine selection needs.
Step 3
Get machine recommendation, optional configuration and quotation.
Step 4
Confirm configuration, production, delivery and technical support.
Get a Free Machine Selection Proposal
Send us your material type, size, target thickness, accuracy requirement and production volume. ewirexon will help you choose the right diamond wire cutting machine and provide a quotation.
