硬質・脆性材料用高精度ダイヤモンドワイヤー切断システム
Precision diamond wire cutting systems for quartz, graphite, glass, ceramics, sapphire, semiconductor materials, selected metals, stone, concrete and advanced industrial materials.
Low-Damage Cutting
Reduce kerf loss, chipping and surface damage when cutting quartz, graphite, glass, ceramics, sapphire and other hard brittle materials.
Custom Machine Selection
Tailored equipment for your specific material and process needs
Factory-Direct Price, Engineering Support.
Get competitive pricing from a factory with installation guidance and technical training support.
Choose the Right Diamond Wire Cutting Machine
From laboratory research to industrial mass production, ewirexon provides different diamond wire saw systems for various materials, sizes, accuracy levels and production requirements.
Endless Diamond Wire Saw
当社のエンドレスダイヤモンドワイヤーソーは、超安定した走行精度と低カーフロス、優れた切断面仕上げが特徴です。.
Diamond Multi-Wire Saw
当社のダイヤモンドマルチワイヤーソーは、高い量産効率と優れた歩留まり率、超低TTV制御性能が特徴です。.
卓上型エンドレスループ式ダイヤモンドワイヤーソー
Desktop endless loop diamond wire saws from our company feature compact tabletop design, high-precision hard brittle material cutting and smooth edge finish for laboratory research and small batch processing.
What Material Do You Need to Cut?
Different materials require different wire specifications, tension control, feed speed, fixture design and cooling methods. Send us your material details and we will recommend a suitable cutting solution.
Glass
Ceramics
SiC Wafer
Photovoltaic Wafer
New Material
Brittle Electronic Plate
Magnetic Material
Quartz Crystal
Application Solutions for High-End Manufacturing
Ewirexon diamond wire cutting systems are applied across advanced manufacturing industries where cutting accuracy, material yield and process stability directly affect production results.
Semiconductor Cutting Solutions
- シリコンウェーハのスライシングソリューション
- SiC & Compound Semiconductor Cutting
- マイクロエレクトロニクス部品の精密切断
- チップキャリア＆パッケージ材料切断
Ceramic Material Cutting Solutions
- 窒化アルミニウム基板のスライシング
- ジルコニアセラミック部品の切断
- 電子用セラミック基板の切断
- セラミック切断用ダイヤモンドワイヤーソー
Optics Cutting Solutions
- サファイア基板の切断ソリューション
- 水晶・光学ガラススライス
- 赤外線光学素子の切断
- 精密光学ウェハー加工
PV Energy Cutting Solutions
- モノシリコン／ポリシリコンインゴットのスライシング
- PVウェハのスライシングソリューション
- 新エネルギー電池材料の切断
- 太陽電池モジュール補助材料加工
Glass & Substrate Cutting Solutions
- 薄型ガラスパネル切断
- PCB基板材料のスライス加工
- 脆性電子プレート精密加工
- 高精度な母材の切断
Advanced Material Cutting Solutions
- Graphite & Carbon Material Cutting
- 磁性体＆特殊クリスタルスライス
- 不規則な形状の高硬度ワークの加工
- 新世代機能性材料の加工
Services Support Beyond the Machine
Buying the right machine is only the first step. ewirexon supports customers with installation, parameter consulting, customized equipment development and professional technical training.
Why Choose Ewirexon
Lower Cutting Damage, Less Material Loss
Ewirexon specializes in high-efficiency diamond wire cutting systems for hard and brittle materials, helping customers reduce kerf loss, edge chipping and surface damage.
Integrated R&D and Manufacturing in China
With core operation and research facilities in China, ewirexon supports equipment development, precision manufacturing, testing and delivery from one integrated supply system.
Custom Solutions & Services Support
Machine structure, worktable, wire path, fixture and cutting parameters can be matched to your material and process.
Reliable China Supplier, Lower Purchase Risk
Serving 150+ professional clients worldwide with 40%+ export business, ewirexon combines factory-direct supply, quality standards and international technical support.
品質認証
Ewirexon, a professional diamond wire saw manufacturer, holds ISO 9001, CE certificates to meet safety and compliance requirements for global government and projects.
A Real Team Behind Your Cutting Project
Ewirexon is supported by experienced engineers, production specialists and international sales staff who understand precision diamond wire cutting applications.
Founder & CEO
Sales Manage
プロセス最適化エンジニア
R&D Engineer
シニア・アプリケーション・エンジニア
After-sales Engineer
Whether you need a lab machine, production cutting system or customized equipment, our team helps review your material requirements, recommend suitable configurations and support your project from inquiry to delivery.
Get Your Diamond Wire Saw Proposal in 4 Steps
Step 1
Send your material type, size and cutting requirement.
Step 2
Our engineer reviews your application and machine selection needs.
Step 3
Get machine recommendation, optional configuration and quotation.
Step 4
Confirm configuration, production, delivery and technical support.
Get a Free Machine Selection Proposal
Send us your material type, size, target thickness, accuracy requirement and production volume. ewirexon will help you choose the right diamond wire cutting machine and provide a quotation.
