Knowledge That Elevates Your Operations
Sustained operational excellence demands continuous upskilling. We invest significantly in the training and professional development of our engineering team, while empowering customers and partners with actionable expertise. Our training offerings include both foundational programs at our global headquarters and tailored expert workshops delivered directly on-site at your facilities.
Our precision cutting technology application engineers deliver customized training aligned with your unique operational tasks — such as optimizing production line performance, reducing wire consumption, and enhancing wafer quality consistency. In our foundational course, “Diamond Wire Cutting System Technology”, you will gain in-depth knowledge of core design parameters, process optimization, and maintenance best practices for precision cutting equipment, with a focus on maximizing throughput, minimizing operational costs, and ensuring long-term system reliability.
Our precision cutting technology application engineers deliver tailored training for your team, customized to your unique operational tasks—such as optimizing production line performance, reducing wire consumption, and enhancing wafer quality consistency.
In our basic training course “Diamond Wire Cutting System Technology”, you will gain in-depth knowledge of the core design parameters, process performance, and operational efficiency of precision cutting equipment. You will also receive foundational guidance on cost drivers and best practices for designing high-performance material processing systems. Beyond manufacturing costs, we focus on the impact of every system component on overall production performance.
In this basic training, our experienced application engineers will provide you with a comprehensive overview of the key technical parameters relevant to your operations, so you can design the optimal cutting system for your needs in close collaboration with our expert team.
The basic training course “Diamond Wire Cutting System Technology” is held regularly at our company headquarters. During an optional facility tour, you will get to know our leading precision cutting technology development center firsthand. If required, we are also happy to deliver the basic training as an in-house seminar at your company for larger teams. Simply contact us to find out more.
Founder & CEO | Chief Technology Officer
Diamond wire cutting equipment R&D, hard & brittle material processing solutions, strategic planning & global business development
Phone:
+86-139-18194310
E-Mail:
feizr@ewirexon.com
Overseas Sales Manager | Global Business Specialist
Global market expansion, overseas exhibition operation, customer inquiry negotiation, order whole-process follow-up and global brand promotion
Phone:
+86-175-21086752
E-Mail:
serena@ewirexon.com
Process Optimization Engineer
Cutting parameter tuning, production efficiency improvement, quality stability & yield control
Phone:
+86-139-17193650
E-Mail:
lihui@ewirexon.com
R&D Engineer | Custom Solution Specialist
Custom diamond wire cutting machine design, special material processing & non-standard project support
Phone:
+86-159-00954170
E-Mail:
chubing@ewirexon.com
Senior Application Engineer
SiC wafer, semiconductor substrate & PV silicon ingot cutting process optimization, customer application testing & validation
Phone:
+86-137-95439876
Global Service & After-sales Engineer
On-site installation, technical training, remote support & global logistics coordination
Phone:
+86-138-18468992
End-to-end integration | on-site execution | tailored system builds | professional workshops | Operational Handbook
