Custom Cutting Systems for Graphite & Carbon Material Processing
Graphite and carbon materials are essential for semiconductor, EDM, and new energy industries, valued for high temperature resistance and conductivity. Precision custom cutting shapes these materials into complex components, directly impacting accuracy and efficiency. Diamond wire cutting has become the optimal solution, delivering lower kerf loss, cleaner cuts, and greater flexibility than traditional methods.
In production lines, diamond wire systems perform multi-axis programmable cutting, completing one-time forming of complex profiles with smooth edges and minimal dust. Stable tension control and optimized cooling prevent chipping and deformation, critical for high-purity carbon components.
Our systems maximize material yield with ultra-low kerf loss, ensure clean, low-dust operation, and maintain stable performance in continuous production, supporting large-format workpieces and custom shapes.
Our diamond wire cutting systems provide high-precision, custom profile cutting for graphite electrodes, carbon composites, carbon fiber reinforced materials, and high-purity carbon components. Designed for clean, low-dust processing, the machines ensure minimal material loss and tight dimensional control, even for complex shapes and large-format workpieces. With stable wire tension and intelligent path planning, we deliver consistent cutting quality for semiconductor, EDM, metallurgy, and new energy applications.
| NO. | Parameter | Specification |
| 1 | Model | TCQF15030CNC |
| 2 | Cutting Principle | Endless diamond wire / Physical cutting |
| 3 | Cutting Functions | Slicing / 2D Contour Cutting |
| 4 | Maximum Workpiece Size(mm) | 1200 × 1000 × 1000 mm(L×W×H) |
| 5 | Worktable Size(mm) | 1500×300 |
| 6 | Cutting Planarity Accuracy(mm) | 0.1 |
| 7 | Surface Roughness(μm) | Ra 0.8 μm |
| 8 | Wire Specification(mm) | Ø0.65–1.0/6250 |
| 9 | Tension System | Constant Wire Tension Control |
| 10 | Guide Wheel Quantity | 4 wheels |
| 11 | Drive Motor | Servo motor |
| 12 | Wire Speed (m/s) | 51Max（Adjustable） |
| 13 | Total Power(kW) | 3.6 |
| 14 | Voltage | 220v 50Hz |
| 15 | Control System | Custom-developed Tongcheng T33 system |
| 16 | Footprint (L×W×H)(mm) | 3200×1500×1500 |
| 17 | Gross Weight kg | 3200 |
Build a measurable diamond wire saw factory acceptance test covering safety, capability, wafers, consumables, data, training and SAT handoff.
Build a subsurface-damage and finishing-allowance budget for diamond wire saw cutting of SiC, silicon, sapphire, glass and ceramics.
Decide when batch or stack cutting advanced ceramics improves throughput without sacrificing chips, thickness, cooling or traceability.
Evaluate ultra-fine diamond wire for thin silicon wafer slicing using kerf, bow, breakage, warp, finishing loss and cost per accepted wafer.
Build a practical diamond wire saw preventive-maintenance plan for guide wheels, tension, alignment, coolant and repeatable wafer quality.
Learn how diamond wire saw cutting can improve graphite component yield for SiC crystal growth while controlling dust, geometry and contamination.
