
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Precision Diamond Wire Solutions for Thin Glass Panel Shaping
Ultra-thin glass panels are critical components in high-resolution display devices, automotive instrumentation, and optical applications. Precision profile cutting is essential to achieve complex shapes while maintaining structural integrity and avoiding edge chipping or breakage. Diamond wire cutting offers a non-contact, stress-free solution for processing fragile glass materials.
Our systems deliver micron-level accuracy for cutting cover glass, touch panels, and ultra-thin display glass, The optimized wire path and low-stress cutting technology prevent internal stress and warpage, ensuring superior quality for post-processing lamination and bonding.
Ideal for high-volume electronic manufacturing, our systems feature high-speed processing and compatibility with automated production lines. The compact design and flexible configuration make them suitable for both prototype development and large-scale display panel production.
Our diamond wire cutting systems deliver burr-free, stress-free profile cutting for ultra-thin display glass, cover glass, and automotive glass panels. Engineered for high-volume electronic manufacturing, these systems achieve micron-level dimensional accuracy while eliminating edge chipping and breakage, even for glass as thin as 0.1mm. The optimized wire path and tension control ensure consistent cutting quality across large-format glass, meeting the strict requirements of touch screen, consumer electronics, and automotive display production.
| NO. | Parameter | Specification |
| 1 | Model | EW-D2236 |
| 2 | Workpiece Carrier Plate Size | 110 × 360 mm |
| 3 | Max Workpiece Cutting Envelope | 220 × 360 mm |
| 4 | Cutting Dimensional Accuracy | ±0.02 mm |
| 5 | Worktable Feed Speed Range | 0 ~ 1000 mm/h |
| 6 | Worktable Vertical Travel | 200 mm |
| 7 | Guide Wheel Quantity | 8 Wheels |
| 8 | Total Rated Power | 22 kW |
| 9 | Footprint (L×W×H) | 1942 × 1522 × 2200 mm |
| 10 | Gross Weight | 4800 kg |

Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain

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