Advanced Processing Systems for New-type Functional Material Manufacturing
New-type functional materials (composites, 2D materials, energy storage materials) drive cutting-edge industries like new energy and semiconductors. Precision processing unlocks their unique properties, directly determining device performance. Diamond wire cutting is the key technology, offering ultra-low damage and wide compatibility.
In R&D and production, diamond wire systems perform ultra-fine slicing, ensuring minimal subsurface damage and micron-level accuracy. Flexible configurations support both lab prototyping and mass production, adapting to evolving material needs.
Our systems deliver ultra-low damage cutting to protect material performance, high precision for micro-components, and wide material compatibility, supporting next-generation new energy and semiconductor technologies.
Our diamond wire cutting systems support high-efficiency, high-precision processing of a wide range of new-type functional materials, including composite materials, biomaterials, 2D materials, energy storage materials, and special structural materials. With ultra-fine cutting capability and low-damage processing characteristics, they meet the strict requirements of R&D prototypes and small-batch trial production as well as large-scale mass production.
| NO. | Parameter | Specification |
| 1 | Model | (Customizable, e.g. EW-200) |
| 2 | Cutting Principle | Diamond Wire Mechanical Cold Cutting |
| 3 | Cutting Function | Slicing |
| 4 | Max Workpiece Dimension (L×W×H) | 150 × 150 × 150 mm |
| 5 | Worktable Size (L×W) | 160 × 160 mm |
| 6 | Cutting Flatness Accuracy | ≤ 0.1 mm |
| 7 | Surface Roughness | Ra 0.8 μm |
| 8 | Diamond Wire Specification | Φ0.5 × 1797 mm (Dia. Range: 0.35~0.8 mm) |
| 9 | Tension System | Servo Tension Control |
| 10 | Guide Wheel Quantity | 3 wheels |
| 11 | Drive Motor | Custom Servo Motor |
| 12 | Spindle Speed | 4500 rpm |
| 13 | Main Motor Power | 1.1 kW |
| 14 | Total Power Consumption | 1.5 kW |
| 15 | Power Supply | 220 V / 50 Hz |
| 16 | Control System | Self-developed Tongcheng T30 |
| 17 | Footprint (L×W×H) | Approx. 850 × 800 × 950 mm |
| 18 | Gross Weight | Approx. 560 kg |
Build a measurable diamond wire saw factory acceptance test covering safety, capability, wafers, consumables, data, training and SAT handoff.
Build a subsurface-damage and finishing-allowance budget for diamond wire saw cutting of SiC, silicon, sapphire, glass and ceramics.
Decide when batch or stack cutting advanced ceramics improves throughput without sacrificing chips, thickness, cooling or traceability.
Evaluate ultra-fine diamond wire for thin silicon wafer slicing using kerf, bow, breakage, warp, finishing loss and cost per accepted wafer.
Build a practical diamond wire saw preventive-maintenance plan for guide wheels, tension, alignment, coolant and repeatable wafer quality.
Learn how diamond wire saw cutting can improve graphite component yield for SiC crystal growth while controlling dust, geometry and contamination.
