
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Advanced Processing Systems for New-type Functional Material Manufacturing
New-type functional materials (composites, 2D materials, energy storage materials) drive cutting-edge industries like new energy and semiconductors. Precision processing unlocks their unique properties, directly determining device performance. Diamond wire cutting is the key technology, offering ultra-low damage and wide compatibility.
In R&D and production, diamond wire systems perform ultra-fine slicing, ensuring minimal subsurface damage and micron-level accuracy. Flexible configurations support both lab prototyping and mass production, adapting to evolving material needs.
Our systems deliver ultra-low damage cutting to protect material performance, high precision for micro-components, and wide material compatibility, supporting next-generation new energy and semiconductor technologies.
Our diamond wire cutting systems support high-efficiency, high-precision processing of a wide range of new-type functional materials, including composite materials, biomaterials, 2D materials, energy storage materials, and special structural materials. With ultra-fine cutting capability and low-damage processing characteristics, they meet the strict requirements of R&D prototypes and small-batch trial production as well as large-scale mass production.
| NO. | Parameter | Specification |
| 1 | Model | (Customizable, e.g. EW-200) |
| 2 | Cutting Principle | Diamond Wire Mechanical Cold Cutting |
| 3 | Cutting Function | Slicing |
| 4 | Max Workpiece Dimension (L×W×H) | 150 × 150 × 150 mm |
| 5 | Worktable Size (L×W) | 160 × 160 mm |
| 6 | Cutting Flatness Accuracy | ≤ 0.1 mm |
| 7 | Surface Roughness | Ra 0.8 μm |
| 8 | Diamond Wire Specification | Φ0.5 × 1797 mm (Dia. Range: 0.35~0.8 mm) |
| 9 | Tension System | Servo Tension Control |
| 10 | Guide Wheel Quantity | 3 wheels |
| 11 | Drive Motor | Custom Servo Motor |
| 12 | Spindle Speed | 4500 rpm |
| 13 | Main Motor Power | 1.1 kW |
| 14 | Total Power Consumption | 1.5 kW |
| 15 | Power Supply | 220 V / 50 Hz |
| 16 | Control System | Self-developed Tongcheng T30 |
| 17 | Footprint (L×W×H) | Approx. 850 × 800 × 950 mm |
| 18 | Gross Weight | Approx. 560 kg |

Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain

A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine

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