新世代機能性材料の加工


Advanced Processing Systems for New-type Functional Material Manufacturing

New-type functional materials (composites, 2D materials, energy storage materials) drive cutting-edge industries like new energy and semiconductors. Precision processing unlocks their unique properties, directly determining device performance. Diamond wire cutting is the key technology, offering ultra-low damage and wide compatibility.

In R&D and production, diamond wire systems perform ultra-fine slicing, ensuring minimal subsurface damage and micron-level accuracy. Flexible configurations support both lab prototyping and mass production, adapting to evolving material needs.

Our systems deliver ultra-low damage cutting to protect material performance, high precision for micro-components, and wide material compatibility, supporting next-generation new energy and semiconductor technologies.

Advanced Processing Solutions for New-type Functional Materials

Our diamond wire cutting systems support high-efficiency, high-precision processing of a wide range of new-type functional materials, including composite materials, biomaterials, 2D materials, energy storage materials, and special structural materials. With ultra-fine cutting capability and low-damage processing characteristics, they meet the strict requirements of R&D prototypes and small-batch trial production as well as large-scale mass production.

新型機能性材料加工

Benefits
  • High compatibility with various new functional and composite materials
  • Ultra-low damage to protect material performance and structure
  • Flexible configuration for R&D, pilot and mass production lines
  • High precision and stability for high-value new materials
  • New energy functional materials and energy storage components
  • Biomedical materials and high-performance structural composites
  • Cutting-edge 2D materials and semiconductor functional substrates
NO.パラメータ仕様
1モデル(カスタマイズ可能、例:EW-200)
2切断の原理ダイヤモンドワイヤーによる機械式冷間切断
3切断機能スライス
4ワークピースの最大寸法(長さ×幅×高さ)150 × 150 × 150 mm
5作業台のサイズ(長さ×幅)160 × 160 mm
6切断平坦度精度≤ 0.1 mm
7表面粗さRa 0.8 μm
8ダイヤモンドワイヤーの仕様Φ0.5 × 1797 mm(直径範囲:0.35~0.8 mm)
9テンションシステムサーボ式張力制御
10ガイドホイールの数量3つの車輪
11駆動モーター特注サーボモーター
12主軸回転数4500 rpm
13主モーター出力1.1 kW
14総消費電力1.5 kW
15電源220 V / 50 Hz
16制御システム自社開発のTongcheng T30
17外形寸法(長さ×幅×高さ)約 850 × 800 × 950 mm
18総重量約560kg
ewirexon - ewirexon precision diamond wire cutting system

Read the Case: Upgrade Processing for New Functional Materials

Comprehensive process optimization for new-type functional material processing brought higher yield, lower material loss and stable overall processing precision.
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ニュース&最新情報

Thick glass core substrate blank being prepared with an endless diamond wire saw and controlled coolant

ガラスコア基板の研究開発におけるダイヤモンドワイヤーソー:適している用途とそうでない用途

ダイヤモンドワイヤーソーがガラスコア基板の研究開発においてどのような役割を果たすのか、エッジの損傷をどのように抑制するのか、また、レーザーやブレードによる個片化のどちらが適しているのかについて学びましょう。.

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