ジルコニアセラミック部品の切断


High-Precision Diamond Wire Cutting Systems for Structural Ceramic & Component Machining

Structural ceramic and zirconia component processing is indispensable in a wide variety of advanced manufacturing industries, where the demand for high-precision, complex-shaped ceramic parts can hardly be avoided. Typical end applications include mechanical engineering components, medical ceramic implants, industrial structural parts, as well as electronic ceramic substrates and high-temperature ceramic components.

The common task of the various cutting systems is to process hard, brittle ceramic materials with ultra-tight dimensional accuracy, to achieve minimal kerf loss and sub-surface damage via optimized wire tension control and precision tooling depending on the material, and to deliver finished parts ready for post-processing. This maximizes material yield and ensures the reliability of ceramic components in end applications. In order to make the whole production process cost-efficient and to create stable, high-quality output around the equipment, the diamond wire cutting systems used in the production lines must have high process stability and low maintenance requirements. We offer you the appropriate cutting solutions for this application, which at the same time comply with the latest industry standards for precision and performance

Zirconia & Structural Ceramic Cutting

Benefits
  • Flexible production line integration
  • As compact cutting system design with multiple wire tension control modes allows space-saving plant layouts.
  • High material yield & low kerf loss
  • Even ultra-thin substrate requirements are met thanks to the precision wire path and low-stress cutting performance of the system.
  • Efficient, long-lasting system design with low maintenance costs
  • made possible by cutting systems that are optimally matched to the material, maximum use of the wire’s cutting potential, and whose structural strength has been confirmed in cycle tests.
  • Structural ceramic component machining
  • Zirconia ceramic part cutting & profiling
  • High-hardness technical ceramic processing
  • Industrial ceramic structural component manufacturing
  • Medical ceramic implant blank slicing
  • Mechanical engineering ceramic parts processing
  • High-temperature ceramic component dicing
NO.パラメータ仕様
1モデルTCQF400LNC-FM-HL
2切断の原理Endless diamond wire / Physical cutting
3Cutting FunctionsSlicing / Angle & Profile Cutting
4Maximum Workpiece Size(mm)Φ600mm, Height 500mm
5Worktable Size(mm)Ø380 转台
6Cutting Planarity Accuracy(mm)0.08
7Surface Roughness(μm)Ra 0.8μm
8Wire Specification(mm)Ø0.65–1.0/2580
9テンションシステムConstant Wire Tension Control
10ガイドホイールの数量4 wheels
11駆動モーターServo motor
12Wire Speed (m/s)51Max(Adjustable)
13Total Power(kW)2.8
14Voltage220v 50Hz
15制御システムCustom-developed Tongcheng T32 system
16Footprint (L×W×H)(mm)1350×1066×1968
17Gross Weight kg720
ewirexon - ewirexon precision diamond wire cutting system

Case Study: Zirconia & Structural Ceramic Parts Cutting

A semiconductor manufacturer partnered with ewirexon to upgrade its cutting process for ceramic components, achieving higher yield, lower material waste, and consistent production precision.
Want to know more project cases? Feel free to write us!

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ニュース&最新情報

Thick glass core substrate blank being prepared with an endless diamond wire saw and controlled coolant

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