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モノシリコン／ポリシリコンインゴットのスライシング

Precision Diamond Wire Cutting Solutions for PV Manufacturing

Monocrystalline and polycrystalline silicon ingots are the foundational raw materials for high-efficiency photovoltaic solar cells. Precision slicing into ultra-thin wafers is a critical process that directly determines material utilization, wafer quality, and solar module conversion efficiency. Diamond wire cutting has become the global industry standard, delivering far higher efficiency, lower kerf loss, and superior surface quality than traditional slurry sawing.

In modern PV production lines, diamond wire saws perform multi-wire reciprocating cutting to slice ingots into hundreds of wafers in a single pass. The process demands extreme precision in wire tension, cutting speed, and cooling to ensure consistent thickness, minimal breakage, and low surface damage—key requirements for high-performance N-type and P-type solar cells.

Our diamond wire cutting systems deliver ultra-low kerf loss to maximize material yield, high throughput to reduce production costs, and stable operation for large-size ingots (up to G12+), meeting the evolving demands of the global solar industry.

Diamond Wire Cutting Systems for PV Ingot Slicing

Our diamond wire cutting systems deliver ultra-precise slicing for monocrystalline and polycrystalline silicon ingots, the core raw material of high-efficiency solar cells. Engineered for industrial PV production lines, these systems achieve ultra-low kerf loss to maximize material yield, while maintaining stable tension control for consistent wafer thickness across large-size ingots (up to G12+). Built with high-rigidity frames and intelligent cutting algorithms, they ensure minimal breakage and low surface damage, meeting the strict quality requirements of N-type and P-type solar cell manufacturing.

モノ／ポリシリコンインゴットスライス

Key Advantages
  • Maximized Material Utilization: Ultra-narrow kerf loss reduces raw material waste, directly lowering production costs for PV manufacturers.
  • High Throughput & Efficiency: Multi-wire reciprocating cutting enables high-speed slicing, boosting daily output and reducing labor costs.
  • Stable & Reliable Operation: Robust mechanical structure and automatic tension control ensure long-term, stable performance in 24/7 industrial environments.
  • Compatible with Large-Size Ingots: Fully supports G12 and next-generation large-format silicon ingots, future-proofing your production line.
  • Mono/poly silicon ingot slicing for PV wafer production
  • Large-size ingot processing for high-efficiency solar cell factories
  • Pilot line R&D and mass production for PV manufacturing
NO. パラメータ 仕様
1 モデル TCQF15030CNC
2 切断の原理 エンドレス・ダイヤモンドワイヤー／物理的切断
3 切断機能 Slicing / 2D Contour Cutting
4 最大ワークサイズ（mm） 1200 × 1000 × 1000 mm(L×W×H)
5 作業台のサイズ（mm） 1500×300
6 切断平面度精度（mm） 0.1
7 表面粗さ（μm） Ra 0.8 μm
8 ワイヤの仕様（mm） Ø0.65–1.0/6250
9 テンションシステム ワイヤ張力の恒常制御
10 ガイドホイールの数量 4輪
11 駆動モーター サーボモーター
12 ワイヤ速度（m/s） 51Max（調整可能）
13 総出力（kW） 3.6
14 電圧 220V 50Hz
15 制御システム Custom-developed Tongcheng T33 system
16 外形寸法（長さ×幅×高さ）（mm） 3200×1500×1500
17 総重量（kg） 3200
ewirexon - ewirexon precision diamond wire cutting system

Read the Case: Achieve Better Results in Silicon Ingot Slicing

For mono silicon ingot slicing, our joint process upgrade helped the client boost yield, control material loss and achieve stable slicing precision in mass production.
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