Diamond Wire Cutting Systems for Package Substrate Slicing & Precision Component Cutting
Chip carrier and package material precision cutting systems can make the difference between yield and scrap in high-volume semiconductor packaging. They provide a reliable processing solution by cutting brittle, multi-layer packaging substrates and lead frames with ultra-high accuracy. Especially for packaging manufacturers, many factors have to be kept in mind in order to be able to guarantee the dimensional accuracy and structural integrity of the components.
In order to process multi-layer packaging materials with complex structures and high hardness, a stable cutting process must be achieved with minimal kerf loss and sub-surface damage. To ensure that the increasing precision requirements of advanced packaging do not lead to component defects or yield loss, the performance of the cutting systems used must be guaranteed at all times. In order to be able to guarantee this performance, diamond wire cutting systems must be tested in accordance with semiconductor industry standards at accredited testing laboratories.
Industry-standard certified cutting systems are subject to defined guidelines with regard to process modifications. ewirexon uses a special production and process optimization process to help you ensure that the high qualitative requirements of advanced packaging are met.
ewirexon diamond wire cutting systems for package material processing are characterized by an optimum price/performance ratio and are particularly suitable for precision cutting of chip carriers, lead frames and multi-layer packaging substrates. The systems generate ultra-high cutting accuracy with minimal kerf loss in limited production space. With rigid machine frames that can meet the strict precision requirements of advanced packaging, ewirexon offers an efficient and reliable option for fabs that handle both R&D prototyping and high-volume production at the same time. Thanks to a wide range of performance and customized process parameters, manufacturers of semiconductor packaging can reduce their component diversity with ewirexon’s Package Material Cutting solution.
| NO. | パラメータ | 仕様 |
| 1 | モデル | TCQF400LNC-FM-HL |
| 2 | 切断の原理 | エンドレス・ダイヤモンドワイヤー／物理的切断 |
| 3 | 切断機能 | スライス加工／角度・形状切断 |
| 4 | 最大ワークサイズ（mm） | Φ600mm、高さ500mm |
| 5 | 作業台のサイズ（mm） | Ø380 转台 |
| 6 | 切断平面度精度（mm） | 0.08 |
| 7 | 表面粗さ（μm） | Ra 0.8μm |
| 8 | ワイヤの仕様（mm） | Ø0.65–1.0/2580 |
| 9 | テンションシステム | ワイヤ張力の恒常制御 |
| 10 | ガイドホイールの数量 | 4輪 |
| 11 | 駆動モーター | サーボモーター |
| 12 | ワイヤ速度（m/s） | 51Max（調整可能） |
| 13 | 総出力（kW） | 2.8 |
| 14 | 電圧 | 220V 50Hz |
| 15 | 制御システム | 特注開発のTongcheng T32システム |
| 16 | 外形寸法（長さ×幅×高さ）（mm） | 1350×1066×1968 |
| 17 | 総重量（kg） | 720 |
In the demanding semiconductor packaging industry, certified high-precision cutting solutions are indispensable. This case study looks at the complex challenge of developing a high-yield diamond wire cutting system that has to process ultra-thin, multi-layer packaging materials reliably with minimal kerf loss. How was our customer able to not only meet the strict precision requirements of advanced packaging, but even exceed them? What role did the strategic partnership with ewirexon play in this challenging project?
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