Chip carrier and package material precision cutting systems can make the difference between yield and scrap in high-volume semiconductor packaging. They provide a reliable processing solution by cutting brittle, multi-layer packaging substrates and lead frames with ultra-high accuracy. Especially for packaging manufacturers, many factors have to be kept in mind in order to be able to guarantee the dimensional accuracy and structural integrity of the components.

In order to process multi-layer packaging materials with complex structures and high hardness, a stable cutting process must be achieved with minimal kerf loss and sub-surface damage. To ensure that the increasing precision requirements of advanced packaging do not lead to component defects or yield loss, the performance of the cutting systems used must be guaranteed at all times. In order to be able to guarantee this performance, diamond wire cutting systems must be tested in accordance with semiconductor industry standards at accredited testing laboratories.

Industry-standard certified cutting systems are subject to defined guidelines with regard to process modifications. ewirexon uses a special production and process optimization process to help you ensure that the high qualitative requirements of advanced packaging are met.