Diamond Wire Cutting Systems for Optical Wafer Slicing, LED Substrate Dicing, and Photonic Wafer Processing
In high-volume optoelectronic and semiconductor manufacturing, the precise, low-stress slicing of optical wafers and sapphire substrates is a critical process that directly impacts material yield, production efficiency, and final device performance.
To meet these demands, diamond wire cutting equipment must maintain a stable operating point with exceptional dimensional accuracy and consistent process control, whether deployed in multi-wire saws for high-throughput production or single-wire systems for ultra-precision applications. Similar technical rigor is required for photonic wafer processing and LED substrate dicing, where even tighter thickness tolerances and superior surface flatness are essential for high-performance optoelectronic devices.
Beyond core cutting performance, modern wafer processing equipment must also deliver long-term operational value: minimal material waste and sub-surface damage to reduce raw material costs, high reliability and energy efficiency for cleanroom production environments, and optimized material utilization to offset rising input costs. These factors make diamond wire cutting systems increasingly critical for cost-effective, scalable optoelectronic manufacturing.
The Precision Optical Wafer Processing systems are specially designed for optical wafer slicing, LED sapphire substrate dicing, and photonic crystal wafer processing. For these applications, ewirexon offers configuration options with high-precision multi-wire saws as well as single-wire cutting units. Both options feature an extremely stable, vibration-damped steel frame design. The multi-wire system achieves very high production efficiency (high volume, ultra-low kerf loss) in a compact footprint, while the single-wire unit delivers superior dimensional accuracy for thin wafers. Both options integrate seamlessly into automated wafer processing lines and can be swapped depending on production requirements, enabling ideal alignment to customer-specific manufacturing workflows with minimal setup changes.
| 아니요. | 매개변수 | 사양 |
| 1 | 모델 | TCQF600PNC |
| 2 | 절단 원리 | 무한 다이아몬드 와이어 / 물리적 절단 |
| 3 | 절단 기능 | Flat Cutting / Rotary Slicing |
| 4 | 최대 공작물 크기(mm) | 200 × 200 × 220 mm (L×W×H) |
| 5 | 작업대 크기(mm) | Ø600 转台 |
| 6 | 절단 평탄도 정밀도(mm) | 0.1 |
| 7 | 표면 거칠기(μm) | Ra 0.8 μm |
| 8 | 와이어 사양(mm) | 0.65–1.0/3720 |
| 9 | 장력 시스템 | 일정한 와이어 장력 제어 |
| 10 | 가이드 휠 수량 | 3륜 |
| 11 | 구동 모터 | 서보 모터 |
| 12 | 와이어 속도 (m/s) | 51Max（조절 가능） |
| 13 | Total Power | 3.3 |
| 14 | 전압 | 380v 50Hz |
| 15 | 제어 시스템 | Custom-developed Tongcheng T30 system |
| 16 | 치수 (길이×폭×높이)(mm) | 1650×1750×2010 |
| 17 | 총 중량 (kg) | 1250 |
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