Diamond Wire Cutting Systems for Optical Wafer Slicing, LED Substrate Dicing, and Photonic Wafer Processing
In high-volume optoelectronic and semiconductor manufacturing, the precise, low-stress slicing of optical wafers and sapphire substrates is a critical process that directly impacts material yield, production efficiency, and final device performance.
To meet these demands, diamond wire cutting equipment must maintain a stable operating point with exceptional dimensional accuracy and consistent process control, whether deployed in multi-wire saws for high-throughput production or single-wire systems for ultra-precision applications. Similar technical rigor is required for photonic wafer processing and LED substrate dicing, where even tighter thickness tolerances and superior surface flatness are essential for high-performance optoelectronic devices.
Beyond core cutting performance, modern wafer processing equipment must also deliver long-term operational value: minimal material waste and sub-surface damage to reduce raw material costs, high reliability and energy efficiency for cleanroom production environments, and optimized material utilization to offset rising input costs. These factors make diamond wire cutting systems increasingly critical for cost-effective, scalable optoelectronic manufacturing.
The Precision Optical Wafer Processing systems are specially designed for optical wafer slicing, LED sapphire substrate dicing, and photonic crystal wafer processing. For these applications, ewirexon offers configuration options with high-precision multi-wire saws as well as single-wire cutting units. Both options feature an extremely stable, vibration-damped steel frame design. The multi-wire system achieves very high production efficiency (high volume, ultra-low kerf loss) in a compact footprint, while the single-wire unit delivers superior dimensional accuracy for thin wafers. Both options integrate seamlessly into automated wafer processing lines and can be swapped depending on production requirements, enabling ideal alignment to customer-specific manufacturing workflows with minimal setup changes.
| नहीं।. | पैरामीटर | विनिर्देश |
| 1 | मॉडल | TCQF600PNC |
| 2 | काटन का सिद्धांत | अनंत हीरे की तार / भौतिक काटना |
| 3 | काटने के कार्य | Flat Cutting / Rotary Slicing |
| 4 | अधिकतम वर्कपीस आकार (मिमी) | 200 × 200 × 220 mm (L×W×H) |
| 5 | कार्य-टेबल का आकार (मिमी) | Ø600 转台 |
| 6 | कटिंग समतलता सटीकता (मिमी) | 0.1 |
| 7 | सतही खुरदरापन (माइक्रोमीटर) | रे 0.8 माइक्रोमीटर |
| 8 | तार विनिर्देश (मिमी) | 0.65–1.0/3720 |
| 9 | तनाव प्रणाली | सतत तार तनाव नियंत्रण |
| 10 | गाइड व्हील की मात्रा | तीन पहिये |
| 11 | चालक मोटर | सर्भो मोटर |
| 12 | तार की गति (मी/से) | 51मैक्स (समायोज्य) |
| 13 | Total Power | 3.3 |
| 14 | वोल्टेज | 380v 50Hz |
| 15 | नियंत्रण प्रणाली | Custom-developed Tongcheng T30 system |
| 16 | फुटप्रिंट (लंबाई×चौड़ाई×ऊंचाई)(मिमी) | 1650×1750×2010 |
| 17 | कुल वजन किग्रा | 1250 |
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