How to Reduce Kerf Loss in SiC Wafer Cutting
जून 17, 2026
Learn how to reduce kerf loss in SiC wafer cutting, why SiC is difficult to slice, and how diamond wire saw systems improve yield and quality.
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Learn how to reduce kerf loss in SiC wafer cutting, why SiC is difficult to slice, and how diamond wire saw systems improve yield and quality.
Learn why precision diamond wire saw technology is critical for SiC wafer cutting, kerf loss reduction, surface quality, yield and equipment selection.
We are pleased to announce that ewirexon, a professional manufacturer of precision diamond wire cutting machines, will participate in CIOE 2026 (27th China International Optoelectronic Exposition) alongside the International IC Innovation Expo (IICIE) and Shenzhen International Electronics Show (ELEXCON). Taking place from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), this three-in-one industrial exhibition gathers global leaders in optoelectronics,
The global hard material processing industry is converging in Shanghai, and ewirexon — the precision cutting brand of Shanghai Tongcheng Industrial Co., Ltd. — is ready to showcase next-generation diamond wire cutting solutions at The 18th China International Exhibition for Powder Metallurgy & Cemented Carbides (PM CHINA 2026), held March 24–26, 2026. Co-located with the Advanced Ceramics, Magnetic Materials, Additive Manufacturing
Exciting news! Our team is ready to welcome you at LASER WORLD OF PHOTONICS CHINA 2026, taking place March 18-20, 2026 at the Shanghai New International Expo Centre. As one of Asia’s premier gatherings for laser, photonics and precision manufacturing professionals, the event brings together industry leaders, engineers, and innovators from across the globe – and ewirexon, a brand of Shanghai Tongcheng