High-Precision Wire Saw Systems for Electronic Substrate Processing
Rigid, flexible, and rigid-flex circuit substrates form the backbone of electronic devices, from consumer gadgets to industrial control systems. Precision slicing of these substrates is essential to maintain circuit integrity, flatness, and electrical performance. Diamond wire cutting provides a damage-free alternative to traditional methods, preserving substrate properties and eliminating delamination.
Our specialized systems deliver precise, clean slicing for FR-4, ceramic, polyimide, and copper-clad laminates, ensuring consistent thickness and flatness across large-format panels. The closed-loop tension control and real-time monitoring prevent micro-cracks and fiber damage, critical for high-density, fine-pitch circuit boards.
Suitable for both R&D prototyping and mass production, our solutions support high-throughput processing for multi-layer PCBs and advanced circuit substrates. The intelligent CNC control allows for precise parameter adjustment, ensuring compatibility with the latest PCB technologies and flexible circuit manufacturing processes.
Our diamond wire cutting solutions are tailored for high-precision slicing of rigid, flexible, and rigid-flex PCB base materials, ceramic substrates, and semiconductor packaging substrates. The systems feature closed-loop tension control and real-time monitoring, ensuring consistent thickness, flatness, and damage-free cutting for high-density, fine-pitch circuit boards. This eliminates delamination and micro-cracks, directly improving PCB yield and reliability in mass production.
| नहीं।. | पैरामीटर | विनिर्देश |
| 1 | मॉडल | टीसीक्यूएफ400एलएनसी-एफएम-एचएल |
| 2 | काटन का सिद्धांत | अनंत हीरे की तार / भौतिक काटना |
| 3 | काटने के कार्य | स्लाइसिंग / कोण और प्रोफ़ाइल कटिंग |
| 4 | अधिकतम वर्कपीस आकार (मिमी) | Φ600 मिमी, ऊँचाई 500 मिमी |
| 5 | कार्य-टेबल का आकार (मिमी) | Ø380 转台 |
| 6 | कटिंग समतलता सटीकता (मिमी) | 0.08 |
| 7 | सतही खुरदरापन (माइक्रोमीटर) | रे 0.8 माइक्रोमीटर |
| 8 | तार विनिर्देश (मिमी) | Ø0.65–1.0/2580 |
| 9 | तनाव प्रणाली | सतत तार तनाव नियंत्रण |
| 10 | गाइड व्हील की मात्रा | चार पहिये |
| 11 | चालक मोटर | सर्भो मोटर |
| 12 | तार की गति (मी/से) | 51मैक्स (समायोज्य) |
| 13 | कुल शक्ति (किलोवाट) | 2.8 |
| 14 | वोल्टेज | 220v 50Hz |
| 15 | नियंत्रण प्रणाली | विशेष रूप से विकसित टोंगचेंग टी32 प्रणाली |
| 16 | फुटप्रिंट (लंबाई×चौड़ाई×ऊंचाई)(मिमी) | १३५०×१०६६×१९६८ |
| 17 | कुल वजन किग्रा | 720 |
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