用于玻璃芯基板研发的金刚石线锯：适用与不适用之处
2026年7月23日
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了解金刚石线锯在玻璃芯基板研发中的应用场景，如何控制边缘损伤，以及在何种情况下选择激光或刀片分片更为合适。.
High-Precision Wire Saw Systems for Electronic Substrate Processing
Rigid, flexible, and rigid-flex circuit substrates form the backbone of electronic devices, from consumer gadgets to industrial control systems. Precision slicing of these substrates is essential to maintain circuit integrity, flatness, and electrical performance. Diamond wire cutting provides a damage-free alternative to traditional methods, preserving substrate properties and eliminating delamination.
Our specialized systems deliver precise, clean slicing for FR-4, ceramic, polyimide, and copper-clad laminates, ensuring consistent thickness and flatness across large-format panels. The closed-loop tension control and real-time monitoring prevent micro-cracks and fiber damage, critical for high-density, fine-pitch circuit boards.
Suitable for both R&D prototyping and mass production, our solutions support high-throughput processing for multi-layer PCBs and advanced circuit substrates. The intelligent CNC control allows for precise parameter adjustment, ensuring compatibility with the latest PCB technologies and flexible circuit manufacturing processes.
Our diamond wire cutting solutions are tailored for high-precision slicing of rigid, flexible, and rigid-flex PCB base materials, ceramic substrates, and semiconductor packaging substrates. The systems feature closed-loop tension control and real-time monitoring, ensuring consistent thickness, flatness, and damage-free cutting for high-density, fine-pitch circuit boards. This eliminates delamination and micro-cracks, directly improving PCB yield and reliability in mass production.
| 不. | 参数 | 规格 |
| 1 | 模型 | TCQF400LNC-FM-HL |
| 2 | 切割原理 | 无尽金刚石线/物理切割 |
| 3 | 切割功能 | 切片 / 角材和型材切割 |
| 4 | 最大工件尺寸（毫米） | Φ600毫米，高度500毫米 |
| 5 | 工作台尺寸（毫米） | Ø380 转台 |
| 6 | 切割平面精度（毫米） | 0.08 |
| 7 | 表面粗糙度（μm） | Ra 0.8μm |
| 8 | 电线规格（毫米） | Ø0.65-1.0/2580 |
| 9 | 张力系统 | 恒线张力控制 |
| 10 | 导轮数量 | 4 轮 |
| 11 | 驱动电机 | 伺服电机 |
| 12 | 线速（米/秒） | 51Max（可调） |
| 13 | 总功率（千瓦） | 2.8 |
| 14 | 电压 | 220 伏 50 赫兹 |
| 15 | 控制系统 | 定制开发的通程 T32 系统 |
| 16 | 占地面积（长×宽×高）（毫米） | 1350×1066×1968 |
| 17 | 毛重 千克 | 720 |
了解金刚石线锯在玻璃芯基板研发中的应用场景，如何控制边缘损伤，以及在何种情况下选择激光或刀片分片更为合适。.
了解如何通过使用金刚石线锯并制定可量化的试切方案，来控制钕铁硼磁体切割过程中的波纹、崩边、线锯磨损和材料损失。.
