High-Precision Wire Saw Systems for Electronic Substrate Processing
Rigid, flexible, and rigid-flex circuit substrates form the backbone of electronic devices, from consumer gadgets to industrial control systems. Precision slicing of these substrates is essential to maintain circuit integrity, flatness, and electrical performance. Diamond wire cutting provides a damage-free alternative to traditional methods, preserving substrate properties and eliminating delamination.
Our specialized systems deliver precise, clean slicing for FR-4, ceramic, polyimide, and copper-clad laminates, ensuring consistent thickness and flatness across large-format panels. The closed-loop tension control and real-time monitoring prevent micro-cracks and fiber damage, critical for high-density, fine-pitch circuit boards.
Suitable for both R&D prototyping and mass production, our solutions support high-throughput processing for multi-layer PCBs and advanced circuit substrates. The intelligent CNC control allows for precise parameter adjustment, ensuring compatibility with the latest PCB technologies and flexible circuit manufacturing processes.
Our diamond wire cutting solutions are tailored for high-precision slicing of rigid, flexible, and rigid-flex PCB base materials, ceramic substrates, and semiconductor packaging substrates. The systems feature closed-loop tension control and real-time monitoring, ensuring consistent thickness, flatness, and damage-free cutting for high-density, fine-pitch circuit boards. This eliminates delamination and micro-cracks, directly improving PCB yield and reliability in mass production.
| НЕТ. | Параметр | Технические характеристики |
| 1 | Модель | TCQF400LNC-FM-HL |
| 2 | Принцип резки | Бесконечная алмазная леска / Механическая резка |
| 3 | Функции резки | Нарезка / Резка под углом и по профилю |
| 4 | Максимальный размер заготовки (мм) | Φ600 мм, высота 500 мм |
| 5 | Размер рабочего стола (мм) | Ø380 转台 |
| 6 | Точность плоскостности реза (мм) | 0.08 |
| 7 | Шероховатость поверхности (мкм) | Ra 0,8 мкм |
| 8 | Характеристики проволоки (мм) | Ø0,65–1,0/2580 |
| 9 | Система натяжения | Контроль постоянного натяжения проволоки |
| 10 | Количество направляющих колес | 4 колеса |
| 11 | Приводной двигатель | Сервомотор |
| 12 | Скорость движения проволоки (м/с) | 51Max (регулируемый) |
| 13 | Общая мощность (кВт) | 2.8 |
| 14 | Напряжение | 220 В, 50 Гц |
| 15 | Система управления | Специально разработанная система Tongcheng T32 |
| 16 | Габаритные размеры (Д × Ш × В) (мм) | 1350×1066×1968 |
| 17 | Брутто-вес, кг | 720 |
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