PCB Taban Malzemesinin Dilimlenmesi


High-Precision Wire Saw Systems for Electronic Substrate Processing

Rigid, flexible, and rigid-flex circuit substrates form the backbone of electronic devices, from consumer gadgets to industrial control systems. Precision slicing of these substrates is essential to maintain circuit integrity, flatness, and electrical performance. Diamond wire cutting provides a damage-free alternative to traditional methods, preserving substrate properties and eliminating delamination.

Our specialized systems deliver precise, clean slicing for FR-4, ceramic, polyimide, and copper-clad laminates, ensuring consistent thickness and flatness across large-format panels. The closed-loop tension control and real-time monitoring prevent micro-cracks and fiber damage, critical for high-density, fine-pitch circuit boards.

Suitable for both R&D prototyping and mass production, our solutions support high-throughput processing for multi-layer PCBs and advanced circuit substrates. The intelligent CNC control allows for precise parameter adjustment, ensuring compatibility with the latest PCB technologies and flexible circuit manufacturing processes.

Precision Slicing Systems for PCB & Circuit Substrates

 

Our diamond wire cutting solutions are tailored for high-precision slicing of rigid, flexible, and rigid-flex PCB base materials, ceramic substrates, and semiconductor packaging substrates. The systems feature closed-loop tension control and real-time monitoring, ensuring consistent thickness, flatness, and damage-free cutting for high-density, fine-pitch circuit boards. This eliminates delamination and micro-cracks, directly improving PCB yield and reliability in mass production.

Devre Altlığı ve PCB Taban Malzemesi Dilimleme

Avantajlar
  • Damage-Free Processing: Prevents substrate delamination and fiber damage, critical for high-frequency PCB performance.
  • Consistent Thickness Control: Maintains uniform substrate thickness across large panels, ensuring stable circuit etching.
  • High Compatibility: Supports a full range of substrate materials, including FR-4, ceramic, polyimide, and copper-clad laminates.
  • High-Efficiency Mass Production: Multi-wire cutting design reduces processing time per panel, lowering production costs.
  • PCB base material slicing for consumer and automotive electronics
  • Ceramic substrate cutting for semiconductor packaging and power modules
  • Flexible circuit substrate processing for wearable and 5G devices
HAYIR.ParametreTeknik Özellikler
1ModelTCQF400LNC-FM-HL
2Kesme PrensibiSonsuz elmas tel / Fiziksel kesim
3Kesme İşlevleriDilimleme / Açı ve Profil Kesimi
4Maksimum İş Parçası Boyutu (mm)Φ600 mm, Yükseklik 500 mm
5Çalışma Masası Boyutu (mm)Ø380 转台
6Kesim Düzlük Hassasiyeti (mm)0.08
7Yüzey Pürüzlülüğü (μm)Ra 0,8 μm
8Tel Özellikleri (mm)Ø0,65–1,0/2580
9Gergi SistemiSabit Tel Gerginliği Kontrolü
10Yönlendirme Tekerleği Adedi4 tekerlek
11Tahrik MotoruServo motor
12Tel Hızı (m/s)51Max (Ayarlanabilir)
13Toplam Güç (kW)2.8
14Gerilim220 V 50 Hz
15Kontrol SistemiÖzel olarak geliştirilmiş Tongcheng T32 sistemi
16Kapladığı alan (U×G×Y) (mm)1350×1066×1968
17Brüt Ağırlık (kg)720
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Read the Case: Improve PCB Base Material Slicing Quality

Professional PCB base material slicing enterprises adopted our solutions to upgrade equipment and workflows, gaining higher yield, lower waste and reliable slicing precision.
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