
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Ultra-Accurate Diamond Wire Systems for Advanced Substrates
High-value base materials such as optical glass, quartz, sapphire, and semiconductor substrates are essential components in precision optical, RF, and optoelectronic devices. Ultra-precise cutting is required to achieve tight tolerances, superior surface quality, and minimal material loss in these high-value applications.
Our high-precision cutting systems deliver industry-leading accuracy, ensuring clean, burr-free cuts with exceptional dimensional consistency. The advanced cooling and tension control systems protect delicate substrates, maintaining their optical, electrical, and mechanical properties for critical applications.
Designed to support both R&D prototyping and large-scale manufacturing, our systems offer scalable performance and versatile material compatibility. The intelligent control interface allows for easy parameter adjustment, ensuring optimal performance across a wide range of advanced base materials and processing requirements.
Our high-precision base material cutting systems deliver industry-leading accuracy for a full range of advanced base materials, including optical glass, quartz, sapphire, and semiconductor substrates. Designed for R&D prototyping and high-volume mass production, these systems achieve tight-tolerance slicing with superior surface quality, eliminating the need for extensive post-processing. The intelligent cutting algorithms and constant temperature control ensure consistent performance across diverse material types and thicknesses.
| HAYIR. | Parametre | Teknik Özellikler |
| 1 | Model | TCQF400LNC-FM-HL |
| 2 | Kesme Prensibi | Sonsuz elmas tel / Fiziksel kesim |
| 3 | Kesme İşlevleri | Dilimleme / Açı ve Profil Kesimi |
| 4 | Maksimum İş Parçası Boyutu (mm) | Φ600 mm, Yükseklik 500 mm |
| 5 | Çalışma Masası Boyutu (mm) | Ø380 转台 |
| 6 | Kesim Düzlük Hassasiyeti (mm) | 0.08 |
| 7 | Yüzey Pürüzlülüğü (μm) | Ra 0,8 μm |
| 8 | Tel Özellikleri (mm) | Ø0,65–1,0/2580 |
| 9 | Gergi Sistemi | Sabit Tel Gerginliği Kontrolü |
| 10 | Yönlendirme Tekerleği Adedi | 4 tekerlek |
| 11 | Tahrik Motoru | Servo motor |
| 12 | Tel Hızı (m/s) | 51Max (Ayarlanabilir) |
| 13 | Toplam Güç (kW) | 2.8 |
| 14 | Gerilim | 220 V 50 Hz |
| 15 | Kontrol Sistemi | Özel olarak geliştirilmiş Tongcheng T32 sistemi |
| 16 | Kapladığı alan (U×G×Y) (mm) | 1350×1066×1968 |
| 17 | Brüt Ağırlık (kg) | 720 |

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