Corte de materiales base de alta precisión


Ultra-Accurate Diamond Wire Systems for Advanced Substrates

High-value base materials such as optical glass, quartz, sapphire, and semiconductor substrates are essential components in precision optical, RF, and optoelectronic devices. Ultra-precise cutting is required to achieve tight tolerances, superior surface quality, and minimal material loss in these high-value applications.

Our high-precision cutting systems deliver industry-leading accuracy, ensuring clean, burr-free cuts with exceptional dimensional consistency. The advanced cooling and tension control systems protect delicate substrates, maintaining their optical, electrical, and mechanical properties for critical applications.

Designed to support both R&D prototyping and large-scale manufacturing, our systems offer scalable performance and versatile material compatibility. The intelligent control interface allows for easy parameter adjustment, ensuring optimal performance across a wide range of advanced base materials and processing requirements.

Ultra-Precision Diamond Wire Cutting for Base Materials

Our high-precision base material cutting systems deliver industry-leading accuracy for a full range of advanced base materials, including optical glass, quartz, sapphire, and semiconductor substrates. Designed for R&D prototyping and high-volume mass production, these systems achieve tight-tolerance slicing with superior surface quality, eliminating the need for extensive post-processing. The intelligent cutting algorithms and constant temperature control ensure consistent performance across diverse material types and thicknesses.

Corte de alta precisión del material base

Ventajas
  • Industry-Leading Precision: Tight tolerance control meets the strict requirements of optical and semiconductor manufacturing.
  • Superior Surface Quality: Low-damage cutting reduces polishing time and costs, improving production efficiency.
  • Versatile Material Support: Processes optical glass, quartz, sapphire, silicon, and other high-value base materials.
  • Scalable Production: Flexible configurations for lab R&D, pilot lines, and full-scale mass production.
  • Optical glass and quartz substrate cutting for optical devices and semiconductors
  • Sapphire wafer slicing for LED and RF devices
  • High-precision base material processing for aerospace and medical electronics
N.º.ParámetroEspecificaciones
1ModeloTCQF400LNC-FM-HL
2Principio de corteAlambre de diamante sin fin / Corte físico
3Funciones de corteCorte en rodajas / Corte en ángulo y de perfiles
4Tamaño máximo de la pieza de trabajo (mm)Φ600 mm, altura 500 mm
5Dimensiones de la mesa de trabajo (mm)Plataforma giratoria de Ø380
6Precisión de planitud del corte (mm)0.08
7Rugosidad superficial (μm)Ra 0,8 μm
8Especificaciones del alambre (mm)Ø 0,65–1,0/2580
9Sistema de tensiónControl de tensión constante del cable
10Cantidad de ruedas guía4 ruedas
11Motor de accionamientoServomotor
12Velocidad del alambre (m/s)51Max (ajustable)
13Potencia total (kW)2.8
14Tensión220 V, 50 Hz
15Sistema de controlSistema Tongcheng T32 desarrollado a medida
16Dimensiones (L × An × Al) (mm)1350 × 1066 × 1968
17Peso bruto (kg)720
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Case Learning: Achieve Top-tier Precision in Base Material Cutting

Process upgrades for high-precision base material cutting greatly improved yield, enhanced material utilization and maintained long-term precision stability.
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