
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Machining Solutions for PV Module Auxiliary Materials
Photovoltaic module production requires precision processing of a range of auxiliary materials, including solar glass, backsheets, aluminum frames, and encapsulation components. Diamond wire cutting delivers clean, stress-free cutting for these brittle and composite materials, ensuring tight tolerances and high edge quality.
Our solutions support customized profile cutting and slicing for all PV module auxiliary materials, enabling high-efficiency, low-waste processing that improves production yield and reduces manufacturing costs for module factories worldwide.
Our diamond wire cutting systems provide precise, stress-free processing for a full range of PV module auxiliary materials, including solar glass, backsheets, aluminum frames, and encapsulation components. Engineered for brittle and composite materials, they deliver clean, burr-free cuts with tight dimensional tolerances, improving production yield and reducing material waste in module manufacturing lines. With customizable profile cutting, they adapt to diverse module designs and production processes.
| N.º. | Parámetro | Especificaciones |
| 1 | Modelo | (Personalizable, p. ej., EW-200) |
| 2 | Principio de corte | Corte en frío mecánico con alambre de diamante |
| 3 | Función de corte | Cortar en rodajas |
| 4 | Dimensiones máximas de la pieza de trabajo (L × W × H) | 150 × 150 × 150 mm |
| 5 | Dimensiones de la mesa de trabajo (largo × ancho) | 160 × 160 mm |
| 6 | Precisión en la planitud del corte | ≤ 0,1 mm |
| 7 | Rugosidad superficial | Ra 0,8 μm |
| 8 | Especificaciones del alambre de diamante | Φ0,5 × 1797 mm (rango de diámetro: 0,35~0,8 mm) |
| 9 | Sistema de tensión | Control de tensión por servo |
| 10 | Cantidad de ruedas guía | 3 ruedas |
| 11 | Motor de accionamiento | Servomotor a medida |
| 12 | Velocidad del husillo | 4500 rpm |
| 13 | Potencia del motor principal | 1,1 kW |
| 14 | Consumo total de energía | 1,5 kW |
| 15 | Fuente de alimentación | 220 V / 50 Hz |
| 16 | Sistema de control | Tongcheng T30, de desarrollo propio |
| 17 | Dimensiones (L × W × H) | Aprox. 850 × 800 × 950 mm |
| 18 | Peso bruto | Aprox. 560 kg |

Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain

A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine

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