Product Portfolio | Diamond Wire Cutting Equipment


High-efficiency Precision Cutting for Advanced Hard & Brittle Materials

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Need help finding the right diamond wire saw?

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Our Product Portfolio

Endless diamond wire saw

Endless diamond wire saw from our company are characterized by ultra-stable running precision and low kerf loss as well as excellent surface cutting finish.
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Diamond multi-wire saw

Diamond multi-wire saw from our company are characterized by high mass-production efficiency and outstanding yield rate as well as ultra-low TTV control performance.
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Desktop endless loop diamond wire saw

Desktop endless loop diamond wire saw from our company are characterized by compact tabletop structure, high-precision hard brittle material cutting performance and smooth edge finish for laboratory research & small batch processing.
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Consumables & auxiliary processing equipment

Consumables & auxiliary processing equipment for endless diamond wire saw and diamond multi-wire saw are characterized by high compatibility, stable performance and perfect matching with lab & mass production cutting needs.
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Endless diamond wire saw

Each series of endless diamond wire saw from our factory has its own special advantages that show their full potential in hard brittle material cutting applications — ultra stable running performance, ultra low kerf loss and perfect smooth cutting surface round off the profile of these machines.

NO.ParameterSpecification
1ModelTCQF400LNC-FM-HL
2Cutting PrincipleEndless diamond wire / Physical cutting
3Cutting FunctionsSlicing / Angle & Profile Cutting
4Maximum Workpiece Size(mm)Φ600mm, Height 500mm
5Worktable Size(mm)Ø380 turntable
6Cutting Planarity Accuracy(mm)0.08
7Surface Roughness(μm)Ra 0.8μm
8Wire Specification(mm)Ø0.65–1.0/2580
9Tension SystemConstant Wire Tension Control
10Guide Wheel Quantity4 wheels
11Drive MotorServo motor
12Wire Speed (m/s)51Max(Adjustable)
13Total Power(kW)2.8
14Voltage220v 50Hz
15Control SystemCustom-developed Tongcheng T32 system
16Footprint (L×W×H)(mm)1350×1066×1968
17Gross Weight kg720

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

Diamond multi-wire saw

 

Our full-series diamond multi-wire saw delivers exclusive performance advantages for professional wafer slicing scenarios, featuring stable mass production running, minimized TTV deviation and outstanding material yield efficiency to define premium processing standards.

NO.ParameterSpecification
1ModelEW-D2236
2Workpiece Carrier Plate Size110 × 360 mm
3Max Workpiece Cutting Envelope220 × 360 mm
4Cutting Dimensional Accuracy±0.02 mm
5Worktable Feed Speed Range0 ~ 1000 mm/h
6Worktable Vertical Travel200 mm
7Guide Wheel Quantity8 Wheels
8Total Rated Power22 kW
9Footprint (L×W×H)1942 × 1522 × 2200 mm
10Gross Weight4800 kg

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

Desktop Endless Loop Diamond Wire Saw

Each model of desktop endless loop diamond wire saw features tailored advantages that fully shine in laboratory precision cutting applications — compact tabletop layout, ultra-high cutting accuracy and flawless edge finish perfectly define its professional performance profile.

NO.ParameterSpecification
1Model(Customizable, e.g. EW-200)
2Cutting PrincipleDiamond Wire Mechanical Cold Cutting
3Cutting FunctionSlicing
4Max Workpiece Dimension (L×W×H)150 × 150 × 150 mm
5Worktable Size (L×W)160 × 160 mm
6Cutting Flatness Accuracy≤ 0.1 mm
7Surface RoughnessRa 0.8 μm
8Diamond Wire SpecificationΦ0.5 × 1797 mm (Dia. Range: 0.35~0.8 mm)
9Tension SystemServo Tension Control
10Guide Wheel Quantity3 wheels
11Drive MotorCustom Servo Motor
12Spindle Speed4500 rpm
13Main Motor Power1.1 kW
14Total Power Consumption1.5 kW
15Power Supply220 V / 50 Hz
16Control SystemSelf-developed Tongcheng T30
17Footprint (L×W×H)Approx. 850 × 800 × 950 mm
18Gross WeightApprox. 560 kg

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

Consumables & Auxiliary Processing Equipment

Each series of consumables & auxiliary processing equipment offers exclusive compatibility advantages that perform perfectly in precision cutting workflows — full model matching grade, stable surface finishing effect and seamless integration for both lab machines and mass production saws round off the complete supporting solution.

ItemSpecification & Description
Diamond Loop WireCustom grit size & wire diameter for cutting ceramics, semiconductors and hard brittle materials
Cutting FluidWater-based cooling and lubricating solution with anti-corrosion and low volatility properties
Wire Guide RollerHigh-precision wear-resistant ceramic roller ensuring stable wire running
Fixing Jig & FixtureCustom tooling for positioning and clamping irregular workpieces
Edge Chamfering MachineProfessional equipment for precision edge chamfering of brittle material substrates
Lapping & Polishing MachinePrecision lapping equipment for surface finishing and flatness calibration
Cleaning AuxiliariesDetergents for dust removal and surface cleaning of post-cutting workpieces
Maintenance Spare PartsBackup bearings, sensors and protective covers for daily equipment maintenance

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

Do you have a question regarding your order or a specific article number?

Serena

Sales Manager

Telephone / whatsapp:

+86-17521086752

E-Mail:

serena@ewirexon.com

Address:

No. 8 Pinglin Branch Road, Distrito de Fengxian, Shanghai, China