High-efficiency Precision Cutting for Advanced Hard & Brittle Materials

High-precision slicing processes account for a major share of production cost and yield performance across semiconductor manufacturing facilities. Therefore, selecting the most suitable diamond wire cutting solution for your materials is critical to achieving stable precision, higher efficiency and lower operational consumption.
The core foundation of nearly every advanced substrate processing workflow lies in professional diamond wire cutting equipment. Whether for lab tabletop research and development, single-loop small-batch slicing, multi-station mass production or custom modular processing systems; equipped with high-tension control units and intelligent parameter panels; designed for hard brittle materials such as silicon carbide, sapphire and advanced ceramics — with ewirexon cutting systems, you will always obtain the optimal configuration tailored to your semiconductor application requirements.
Our engineering team focuses exclusively on semiconductor and advanced material cutting scenarios, cooperating closely with industrial research labs and manufacturing partners to refine equipment structure, process parameters and customized slicing solutions. Efficiency and stable performance remain our core focus at ewirexon. Rational cost control and higher material utilization are essential for sustainable production development. For this reason, we keep optimizing every detail to make precision slicing simpler, more reliable and more cost-effective for both

Ceramic materials demand extreme precision in every stage of processing, and our diamond wire cutting systems are engineered to meet these rigorous challenges head-on. From ultra-thin substrate slicing for electronic components to complex shaping of advanced ceramic parts, our solutions deliver consistent, repeatable results that elevate product quality and production efficiency. We understand that every ceramic application has unique requirements, and our portfolio is designed to adapt to your specific material, tolerance, and throughput needs.
Backed by decades of specialized expertise in brittle material processing, our team collaborates closely with leading manufacturers across ceramics, semiconductors, and advanced packaging to develop cutting-edge solutions that push industry limits. Whether you’re targeting maximum material yield to reduce costs, minimizing sub-surface damage for enhanced component reliability, or streamlining production lines for higher throughput, we combine deep technical know-how with tailored support to turn your challenges into competitive advantages.

Generating an ultra-smooth and precise cut as reliably as possible is especially crucial in the optics industry. Examples of this are the precision processing of optical glass wafers, photonic crystal substrates and high-grade optical components, which place the highest demands on surface quality, edge definition and dimensional stability in the optical sector. The high-precision diamond wire cutting in pre-diced glass or photonic material processing requires extremely tight process control and consistent tension regulation for optimal results.
The precise control of the cutting process across varying material densities is a major challenge that has been mastered very successfully for many years for customers worldwide in the optics industry. At ewirexon, for example, you benefit from individual harmonization of the wire path with customized process parameters, as well as the well-known first-class accuracy of our equipment.

Photovoltaic (PV) manufacturing technology is used in a wide variety of equipment for solar wafer slicing, solar cell processing, and PV panel production. In addition to precisely matched cutting operating points, strict dimensional tolerance requirements and low energy consumption, diamond wire cutting systems for PV production lines must also meet the highest reliability and precision standards. Typical industrial PV manufacturing equipment includes multi-wire saws, single-wire cutting units, wafer processing systems, cell dicing machines, panel assembly lines and more.

Glass and substrate processing technology is used in a wide variety of equipment for optical glass slicing, sapphire substrate dicing, and precision component manufacturing. In addition to precisely matched cutting operating points, strict flatness and surface quality requirements and low energy consumption, diamond wire cutting systems for glass and substrate production lines must also meet the highest precision and reliability standards. Typical industrial glass and substrate processing equipment includes multi-wire saws, single-wire cutting units, wafer thinning systems, lens blank processing machines, custom substrate fabrication lines and more.

Advanced material processing technology is used in a wide variety of equipment for ceramic component machining, hard material slicing, and high-performance material production. In addition to precisely matched cutting operating points, strict material integrity and low-stress processing requirements and low energy consumption, diamond wire cutting systems for advanced material production lines must also meet the highest durability and precision standards. Typical industrial advanced material processing equipment includes multi-wire saws for hard ceramics, single-wire cutting units for technical ceramics, material blank processing systems, custom component machining lines and more.
Our Application Experts will be happy to assist you in finding the optimum fan wheel for your specific application.
Each series of endless diamond wire saw from our factory has its own special advantages that show their full potential in hard brittle material cutting applications — ultra stable running performance, ultra low kerf loss and perfect smooth cutting surface round off the profile of these machines.
| NO. | Parameter | Specification |
| 1 | Model | TCQF400LNC-FM-HL |
| 2 | Cutting Principle | Endless diamond wire / Physical cutting |
| 3 | Cutting Functions | Slicing / Angle & Profile Cutting |
| 4 | Maximum Workpiece Size(mm) | Φ600mm, Height 500mm |
| 5 | Worktable Size(mm) | Ø380 turntable |
| 6 | Cutting Planarity Accuracy(mm) | 0.08 |
| 7 | Surface Roughness(μm) | Ra 0.8μm |
| 8 | Wire Specification(mm) | Ø0.65–1.0/2580 |
| 9 | Tension System | Constant Wire Tension Control |
| 10 | Guide Wheel Quantity | 4 wheels |
| 11 | Drive Motor | Servo motor |
| 12 | Wire Speed (m/s) | 51Max(Adjustable) |
| 13 | Total Power(kW) | 2.8 |
| 14 | Voltage | 220v 50Hz |
| 15 | Control System | Custom-developed Tongcheng T32 system |
| 16 | Footprint (L×W×H)(mm) | 1350×1066×1968 |
| 17 | Gross Weight kg | 720 |
Our full-series diamond multi-wire saw delivers exclusive performance advantages for professional wafer slicing scenarios, featuring stable mass production running, minimized TTV deviation and outstanding material yield efficiency to define premium processing standards.
| NO. | Parameter | Specification |
| 1 | Model | EW-D2236 |
| 2 | Workpiece Carrier Plate Size | 110 × 360 mm |
| 3 | Max Workpiece Cutting Envelope | 220 × 360 mm |
| 4 | Cutting Dimensional Accuracy | ±0.02 mm |
| 5 | Worktable Feed Speed Range | 0 ~ 1000 mm/h |
| 6 | Worktable Vertical Travel | 200 mm |
| 7 | Guide Wheel Quantity | 8 Wheels |
| 8 | Total Rated Power | 22 kW |
| 9 | Footprint (L×W×H) | 1942 × 1522 × 2200 mm |
| 10 | Gross Weight | 4800 kg |
Our application engineers gladly help you choose the best solution for your industrial processing requirements.
Each model of desktop endless loop diamond wire saw features tailored advantages that fully shine in laboratory precision cutting applications — compact tabletop layout, ultra-high cutting accuracy and flawless edge finish perfectly define its professional performance profile.
| NO. | Parameter | Specification |
| 1 | Model | (Customizable, e.g. EW-200) |
| 2 | Cutting Principle | Diamond Wire Mechanical Cold Cutting |
| 3 | Cutting Function | Slicing |
| 4 | Max Workpiece Dimension (L×W×H) | 150 × 150 × 150 mm |
| 5 | Worktable Size (L×W) | 160 × 160 mm |
| 6 | Cutting Flatness Accuracy | ≤ 0.1 mm |
| 7 | Surface Roughness | Ra 0.8 μm |
| 8 | Diamond Wire Specification | Φ0.5 × 1797 mm (Dia. Range: 0.35~0.8 mm) |
| 9 | Tension System | Servo Tension Control |
| 10 | Guide Wheel Quantity | 3 wheels |
| 11 | Drive Motor | Custom Servo Motor |
| 12 | Spindle Speed | 4500 rpm |
| 13 | Main Motor Power | 1.1 kW |
| 14 | Total Power Consumption | 1.5 kW |
| 15 | Power Supply | 220 V / 50 Hz |
| 16 | Control System | Self-developed Tongcheng T30 |
| 17 | Footprint (L×W×H) | Approx. 850 × 800 × 950 mm |
| 18 | Gross Weight | Approx. 560 kg |
Our application engineers gladly help you choose the best solution for your industrial processing requirements.
Each series of consumables & auxiliary processing equipment offers exclusive compatibility advantages that perform perfectly in precision cutting workflows — full model matching grade, stable surface finishing effect and seamless integration for both lab machines and mass production saws round off the complete supporting solution.
| Item | Specification & Description |
| Diamond Loop Wire | Custom grit size & wire diameter for cutting ceramics, semiconductors and hard brittle materials |
| Cutting Fluid | Water-based cooling and lubricating solution with anti-corrosion and low volatility properties |
| Wire Guide Roller | High-precision wear-resistant ceramic roller ensuring stable wire running |
| Fixing Jig & Fixture | Custom tooling for positioning and clamping irregular workpieces |
| Edge Chamfering Machine | Professional equipment for precision edge chamfering of brittle material substrates |
| Lapping & Polishing Machine | Precision lapping equipment for surface finishing and flatness calibration |
| Cleaning Auxiliaries | Detergents for dust removal and surface cleaning of post-cutting workpieces |
| Maintenance Spare Parts | Backup bearings, sensors and protective covers for daily equipment maintenance |
Our application engineers gladly help you choose the best solution for your industrial processing requirements.
Sales Manager
Telephone / whatsapp:
+86-17521086752
E-Mail:
serena@ewirexon.com
Address:
No. 8 Pinglin Branch Road, Fengxian District, Şanghay, Çin
Sales Manager
Telefon / whatsapp:
+86-17521086752
E-Mail:
serena@ewirexon.com
Address:
No. 8 Pinglin Branch Road, Fengxian District, Şanghay, Çin
Sales Manager
Telefon / whatsapp:
+86-17521086752
E-Mail:
serena@ewirexon.com
Address:
No. 8 Pinglin Branch Road, Fengxian District, Şanghay, Çin
Sales Manager
Telefon / whatsapp:
+86-17521086752
E-Mail:
serena@ewirexon.com
Address:
No. 8 Pinglin Branch Road, Fengxian District, Şanghay, Çin
Sales Manager
Telefon / whatsapp:
+86-17521086752
E-Mail:
serena@ewirexon.com
Address:
No. 8 Pinglin Branch Road, Fengxian District, Şanghay, Çin