Precision Slicing Equipment for Magnetic Materials & Special Crystals
Magnetic materials and special crystals are core to electronics, new energy, and optics, used in motors, sensors, and optical devices. Precision slicing of these hard, brittle materials directly affects performance and yield. Diamond wire cutting has replaced traditional blade slicing, becoming the industry standard for low damage and high consistency.
In mass production, diamond wire saws slice magnetic materials (NdFeB, ferrite) and special crystals, ensuring uniform thickness and no damage to material properties. Precise tension, speed, and cooling control are essential for high-performance components.
Our systems deliver ultra-low damage cutting to preserve material properties, achieve high slicing efficiency, and operate stably in industrial environments, compatible with various hard, brittle materials.
Our diamond wire cutting equipment is specially developed for slicing hard and brittle magnetic materials, rare-earth permanent magnets, ferrite materials, and various special crystals. It achieves stable, low-damage slicing with excellent thickness uniformity, effectively avoiding chipping, cracking, and internal stress damage that often occur in traditional processing. The closed-loop control system ensures high consistency in mass production, making it widely used in motors, sensors, communications, and optical devices.
| HAYIR. | Parametre | Teknik Özellikler |
| 1 | Model | TCQF1000PNC |
| 2 | Kesme Prensibi | Endless diamond wire, physical cold cutting |
| 3 | Kesme İşlevleri | Flat Cutting / Rotary Slicing |
| 4 | Maksimum İş Parçası Boyutu (mm) | 380×380×280 mm(L×W×H) |
| 5 | Çalışma Masası Boyutu (mm) | Ø1000 转台 |
| 6 | Kesim Düzlük Hassasiyeti (mm) | 0.1 |
| 7 | Yüzey Pürüzlülüğü (μm) | Ra 0,8 μm |
| 8 | Tel Özellikleri (mm) | Ø1.0/4760 |
| 9 | Gergi Sistemi | Sabit Tel Gerginliği Kontrolü |
| 10 | Yönlendirme Tekerleği Adedi | 3 tekerlek |
| 11 | Tahrik Motoru | Servo motor |
| 12 | Tel Hızı (m/s) | 51Max (Ayarlanabilir) |
| 13 | Total Power (kW) | 3.3 |
| 14 | Gerilim | 380v 50Hz |
| 15 | Kontrol Sistemi | Custom-developed Tongcheng T31 system |
| 16 | Kapladığı alan (U×G×Y) (mm) | 2350×2350×2040 |
| 17 | Brüt Ağırlık (kg) | 1850 |
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine
Build a SiC wafer metrology control plan after diamond wire saw cutting, covering TTV, flatness, bow, warp, edge chips and subsurface damage.
See how 800 VDC AI data center power architectures change SiC wafer cutting, kerf control, surface damage limits and supplier qualification.
Build a practical SiC slicing cost model using kerf loss, yield, wire life, cycle time, finishing allowance and diamond wire saw data.
Learn how 200 mm SiC wafer slicing changes contact length, wire bow, coolant delivery, TTV control and diamond wire saw qualification.
