
How to Reduce Kerf Loss in SiC Wafer Cutting
Learn how to reduce kerf loss in SiC wafer cutting, why SiC is difficult to slice, and how diamond wire saw systems improve yield and quality.
Precision Slicing Equipment for Magnetic Materials & Special Crystals
Magnetic materials and special crystals are core to electronics, new energy, and optics, used in motors, sensors, and optical devices. Precision slicing of these hard, brittle materials directly affects performance and yield. Diamond wire cutting has replaced traditional blade slicing, becoming the industry standard for low damage and high consistency.
In mass production, diamond wire saws slice magnetic materials (NdFeB, ferrite) and special crystals, ensuring uniform thickness and no damage to material properties. Precise tension, speed, and cooling control are essential for high-performance components.
Our systems deliver ultra-low damage cutting to preserve material properties, achieve high slicing efficiency, and operate stably in industrial environments, compatible with various hard, brittle materials.
Our diamond wire cutting equipment is specially developed for slicing hard and brittle magnetic materials, rare-earth permanent magnets, ferrite materials, and various special crystals. It achieves stable, low-damage slicing with excellent thickness uniformity, effectively avoiding chipping, cracking, and internal stress damage that often occur in traditional processing. The closed-loop control system ensures high consistency in mass production, making it widely used in motors, sensors, communications, and optical devices.
| NO. | Parameter | Specification |
| 1 | Model | TCQF1000PNC |
| 2 | Cutting Principle | Endless diamond wire, physical cold cutting |
| 3 | Cutting Functions | Flat Cutting / Rotary Slicing |
| 4 | Maximum Workpiece Size(mm) | 380×380×280 mm(L×W×H) |
| 5 | Worktable Size(mm) | Ø1000 转台 |
| 6 | Cutting Planarity Accuracy(mm) | 0.1 |
| 7 | Surface Roughness(μm) | Ra 0.8 μm |
| 8 | Wire Specification(mm) | Ø1.0/4760 |
| 9 | Tension System | Constant Wire Tension Control |
| 10 | Guide Wheel Quantity | 3 wheels |
| 11 | Drive Motor | Servo motor |
| 12 | Wire Speed (m/s) | 51Max(Adjustable) |
| 13 | Total Power (kW) | 3.3 |
| 14 | Voltage | 380v 50Hz |
| 15 | Control System | Custom-developed Tongcheng T31 system |
| 16 | Footprint (L×W×H)(mm) | 2350×2350×2040 |
| 17 | Gross Weight kg | 1850 |

Learn how to reduce kerf loss in SiC wafer cutting, why SiC is difficult to slice, and how diamond wire saw systems improve yield and quality.

Learn why precision diamond wire saw technology is critical for SiC wafer cutting, kerf loss reduction, surface quality, yield and equipment selection.

We are pleased to announce that ewirexon, a professional manufacturer of precision diamond wire cutting machines, will participate in CIOE 2026 (27th China International Optoelectronic Exposition) alongside the

The global hard material processing industry is converging in Shanghai, and ewirexon — the precision cutting brand of Shanghai Tongcheng Industrial Co., Ltd. — is

Exciting news! Our team is ready to welcome you at LASER WORLD OF PHOTONICS CHINA 2026, taking place March 18-20, 2026 at the Shanghai New International