High-Precision Cutting Systems for Hard Ceramic & Material Processing
As part of advanced manufacturing processes for industrial components, high-hardness ceramic parts are used, for example, in mechanical engineering, medical devices, aerospace and cutting tools. The material brittleness and extreme hardness that occur during machining must be managed with precision to prevent component damage. Efficient diamond wire cutting ensures the dimensional accuracy, surface quality and cost-effectiveness of the entire production process.
High-hardness ceramic components are usually processed with diamond wire cutting systems. Precision wire guides, for example, deliver controlled cutting paths and transport the wire through the material via optimized tension control. The ceramic blank is separated with minimal stress and is thus machined to final tolerance. The finished component is in turn post-processed by the production line. For machining of high-hardness ceramics in industrial manufacturing, both multi-wire and single-wire cutting systems which generate ultra-low kerf loss and consistent process stability are used.
With the High-hardness Ceramic Machining Line, ewirexon supplies high-precision and at the same time extremely robust diamond wire cutting systems for machining advanced ceramic components used in industrial and aerospace applications. The cutting systems, which were specially developed for this application, deliver ultra-tight dimensional accuracy with a compact design, enabling reliable and space-saving processing of the ceramic components used. The High-hardness Ceramic Cutting Line covers a wide range of operating points with a high material removal rate. The extremely robust design of the cutting system ensures resistance even to possible high cutting forces as well as high-temperature processing environments. A variable high-rigidity steel frame design with optional surface treatment provides long-term durability for heavy-duty production.
With the robust system design, wear-resistant materials and worldwide availability of the cutting systems, ewirexon is doing its part to minimize the risk of failure in the critical manufacturing of high-hardness ceramics. Leading global manufacturers from the mechanical engineering and aerospace sectors rely on ewirexon’s decades of experience in brittle material cutting.
| NEIN. | Parameter | Spezifikation |
| 1 | Modell | TCQF400LNC-FM-HL |
| 2 | Cutting Principle | Endless diamond wire / Physical cutting |
| 3 | Cutting Functions | Slicing / Angle & Profile Cutting |
| 4 | Maximum Workpiece Size(mm) | Φ600mm, Height 500mm |
| 5 | Worktable Size(mm) | Ø380 转台 |
| 6 | Cutting Planarity Accuracy(mm) | 0.08 |
| 7 | Surface Roughness(μm) | Ra 0.8μm |
| 8 | Wire Specification(mm) | Ø0.65–1.0/2580 |
| 9 | Tension System | Constant Wire Tension Control |
| 10 | Anzahl der Führungsräder | 4 wheels |
| 11 | Drive Motor | Servo motor |
| 12 | Wire Speed (m/s) | 51Max（Adjustable） |
| 13 | Total Power | 2.8 |
| 14 | Voltage | 220v 50Hz |
| 15 | Control System | Custom-developed Tongcheng T32 system |
| 16 | Footprint (L×W×H)(mm) | 1350×1066×1968 |
| 17 | Gross Weight kg | 720 |
Erfahren Sie, welche Rolle das Diamantdrahtsägen in der Forschung und Entwicklung von Substraten mit Glaskern spielt, wie sich Kantenbeschädigungen vermeiden lassen und wann die Einzelung per Laser oder Sägeblatt die bessere Wahl ist.
Erfahren Sie, wie Sie beim Schneiden von NdFeB-Magneten mit einer Diamantdrahtsäge und einem messbaren Versuchsplan Welligkeit, Abplatzungen, Drahtverschleiß und Materialverlust in den Griff bekommen.
Diagnostizieren Sie Brüche an Diamantdrahtsägen anhand von Hinweisen zu Drahtverlauf, Zugkraft, Belastung, Kühlmittel, Verschleiß und Spannvorrichtung, anstatt Parameteränderungen nach dem Prinzip „Versuch und Irrtum“ vorzunehmen.
Erfahren Sie, wie Sie ein Diamantdrahtsägeverfahren für das Schneiden von AlN-Substraten qualifizieren, Abplatzungen und Schäden im Untergrund kontrollieren und Labor- oder Produktionsanlagen auswählen.
Erfahren Sie, wie die Diamantdrahtsäge-Technologie das Schneiden von Hochleistungskeramik für die Halbleiterverpackung, die Leistungselektronik und Präzisionskomponenten verbessert.
Erfahren Sie, wie die Diamantdrahtsäge-Technologie das Schneiden von Saphirsubstraten für LED-, HF-, Optik- und Halbleiteranwendungen verbessert.
