Corte de piezas de cerámica de circonio


High-Precision Diamond Wire Cutting Systems for Structural Ceramic & Component Machining

Structural ceramic and zirconia component processing is indispensable in a wide variety of advanced manufacturing industries, where the demand for high-precision, complex-shaped ceramic parts can hardly be avoided. Typical end applications include mechanical engineering components, medical ceramic implants, industrial structural parts, as well as electronic ceramic substrates and high-temperature ceramic components.

The common task of the various cutting systems is to process hard, brittle ceramic materials with ultra-tight dimensional accuracy, to achieve minimal kerf loss and sub-surface damage via optimized wire tension control and precision tooling depending on the material, and to deliver finished parts ready for post-processing. This maximizes material yield and ensures the reliability of ceramic components in end applications. In order to make the whole production process cost-efficient and to create stable, high-quality output around the equipment, the diamond wire cutting systems used in the production lines must have high process stability and low maintenance requirements. We offer you the appropriate cutting solutions for this application, which at the same time comply with the latest industry standards for precision and performance

Zirconia & Structural Ceramic Cutting

Ventajas
  • Flexible production line integration
  • As compact cutting system design with multiple wire tension control modes allows space-saving plant layouts.
  • High material yield & low kerf loss
  • Even ultra-thin substrate requirements are met thanks to the precision wire path and low-stress cutting performance of the system.
  • Efficient, long-lasting system design with low maintenance costs
  • made possible by cutting systems that are optimally matched to the material, maximum use of the wire’s cutting potential, and whose structural strength has been confirmed in cycle tests.
  • Structural ceramic component machining
  • Zirconia ceramic part cutting & profiling
  • High-hardness technical ceramic processing
  • Industrial ceramic structural component manufacturing
  • Medical ceramic implant blank slicing
  • Mechanical engineering ceramic parts processing
  • High-temperature ceramic component dicing
N.º.ParámetroEspecificaciones
1ModeloTCQF400LNC-FM-HL
2Principio de corteAlambre de diamante sin fin / Corte físico
3Funciones de corteCorte en rodajas / Corte en ángulo y de perfiles
4Tamaño máximo de la pieza de trabajo (mm)Φ600 mm, altura 500 mm
5Dimensiones de la mesa de trabajo (mm)Plataforma giratoria de Ø380
6Precisión de planitud del corte (mm)0.08
7Rugosidad superficial (μm)Ra 0,8 μm
8Especificaciones del alambre (mm)Ø 0,65–1,0/2580
9Sistema de tensiónControl de tensión constante del cable
10Cantidad de ruedas guía4 ruedas
11Motor de accionamientoServomotor
12Velocidad del alambre (m/s)51Max (ajustable)
13Potencia total (kW)2.8
14Tensión220 V, 50 Hz
15Sistema de controlSistema Tongcheng T32 desarrollado a medida
16Dimensiones (L × An × Al) (mm)1350 × 1066 × 1968
17Peso bruto (kg)720
ewirexon - ewirexon precision diamond wire cutting system

Case Study: Zirconia & Structural Ceramic Parts Cutting

A semiconductor manufacturer partnered with ewirexon to upgrade its cutting process for ceramic components, achieving higher yield, lower material waste, and consistent production precision.
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