氧化锆和结构陶瓷部件切割


High-Precision Diamond Wire Cutting Systems for Structural Ceramic & Component Machining

Structural ceramic and zirconia component processing is indispensable in a wide variety of advanced manufacturing industries, where the demand for high-precision, complex-shaped ceramic parts can hardly be avoided. Typical end applications include mechanical engineering components, medical ceramic implants, industrial structural parts, as well as electronic ceramic substrates and high-temperature ceramic components.

The common task of the various cutting systems is to process hard, brittle ceramic materials with ultra-tight dimensional accuracy, to achieve minimal kerf loss and sub-surface damage via optimized wire tension control and precision tooling depending on the material, and to deliver finished parts ready for post-processing. This maximizes material yield and ensures the reliability of ceramic components in end applications. In order to make the whole production process cost-efficient and to create stable, high-quality output around the equipment, the diamond wire cutting systems used in the production lines must have high process stability and low maintenance requirements. We offer you the appropriate cutting solutions for this application, which at the same time comply with the latest industry standards for precision and performance

Zirconia & Structural Ceramic Cutting

益处
  • 灵活的生产线集成
  • 切割系统设计紧凑,具有多种钢丝张力控制模式,可节省设备布局空间。.
  • 材料产量高,切口损耗低
  • 得益于系统的精密线径和低应力切割性能,即使是超薄基板也能满足要求。.
  • 高效、持久的系统设计,维护成本低
  • 切割系统能与材料最佳匹配,最大限度地发挥金属丝的切割潜力,其结构强度已在循环测试中得到证实。.
  • 结构陶瓷部件加工
  • 氧化锆陶瓷部件切割和仿形
  • 高硬度技术陶瓷加工
  • 工业陶瓷结构件制造
  • 医用陶瓷植入物坯体切片
  • 机械工程陶瓷部件加工
  • 高温陶瓷元件切割
不.参数规格
1模型TCQF400LNC-FM-HL
2切割原理无尽金刚石线/物理切割
3切割功能切片 / 角材和型材切割
4最大工件尺寸(毫米)Φ600毫米,高度500毫米
5工作台尺寸(毫米)Ø380 转台
6切割平面精度(毫米)0.08
7表面粗糙度(μm)Ra 0.8μm
8电线规格(毫米)Ø0.65-1.0/2580
9张力系统恒线张力控制
10导轮数量4 轮
11驱动电机伺服电机
12线速(米/秒)51Max(可调)
13总功率(千瓦)2.8
14电压220 伏 50 赫兹
15控制系统定制开发的通程 T32 系统
16占地面积(长×宽×高)(毫米)1350×1066×1968
17毛重 千克720

Case Study: Zirconia & Structural Ceramic Parts Cutting

A semiconductor manufacturer partnered with ewirexon to upgrade its cutting process for ceramic components, achieving higher yield, lower material waste, and consistent production precision.
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