高精度基材切割


Ultra-Accurate Diamond Wire Systems for Advanced Substrates

High-value base materials such as optical glass, quartz, sapphire, and semiconductor substrates are essential components in precision optical, RF, and optoelectronic devices. Ultra-precise cutting is required to achieve tight tolerances, superior surface quality, and minimal material loss in these high-value applications.

Our high-precision cutting systems deliver industry-leading accuracy, ensuring clean, burr-free cuts with exceptional dimensional consistency. The advanced cooling and tension control systems protect delicate substrates, maintaining their optical, electrical, and mechanical properties for critical applications.

Designed to support both R&D prototyping and large-scale manufacturing, our systems offer scalable performance and versatile material compatibility. The intelligent control interface allows for easy parameter adjustment, ensuring optimal performance across a wide range of advanced base materials and processing requirements.

Ultra-Precision Diamond Wire Cutting for Base Materials

Our high-precision base material cutting systems deliver industry-leading accuracy for a full range of advanced base materials, including optical glass, quartz, sapphire, and semiconductor substrates. Designed for R&D prototyping and high-volume mass production, these systems achieve tight-tolerance slicing with superior surface quality, eliminating the need for extensive post-processing. The intelligent cutting algorithms and constant temperature control ensure consistent performance across diverse material types and thicknesses.

高精度基材切割

益处
  • Industry-Leading Precision: Tight tolerance control meets the strict requirements of optical and semiconductor manufacturing.
  • Superior Surface Quality: Low-damage cutting reduces polishing time and costs, improving production efficiency.
  • Versatile Material Support: Processes optical glass, quartz, sapphire, silicon, and other high-value base materials.
  • Scalable Production: Flexible configurations for lab R&D, pilot lines, and full-scale mass production.
  • Optical glass and quartz substrate cutting for optical devices and semiconductors
  • Sapphire wafer slicing for LED and RF devices
  • High-precision base material processing for aerospace and medical electronics
不.参数规格
1模型TCQF400LNC-FM-HL
2切割原理无尽金刚石线/物理切割
3切割功能切片 / 角材和型材切割
4最大工件尺寸(毫米)Φ600毫米,高度500毫米
5工作台尺寸(毫米)Ø380 转台
6切割平面精度(毫米)0.08
7表面粗糙度(μm)Ra 0.8μm
8电线规格(毫米)Ø0.65-1.0/2580
9张力系统恒线张力控制
10导轮数量4 轮
11驱动电机伺服电机
12线速(米/秒)51Max(可调)
13总功率(千瓦)2.8
14电压220 伏 50 赫兹
15控制系统定制开发的通程 T32 系统
16占地面积(长×宽×高)(毫米)1350×1066×1968
17毛重 千克720
8

Case Learning: Achieve Top-tier Precision in Base Material Cutting

Process upgrades for high-precision base material cutting greatly improved yield, enhanced material utilization and maintained long-term precision stability.
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