
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Ultra-Accurate Diamond Wire Systems for Advanced Substrates
High-value base materials such as optical glass, quartz, sapphire, and semiconductor substrates are essential components in precision optical, RF, and optoelectronic devices. Ultra-precise cutting is required to achieve tight tolerances, superior surface quality, and minimal material loss in these high-value applications.
Our high-precision cutting systems deliver industry-leading accuracy, ensuring clean, burr-free cuts with exceptional dimensional consistency. The advanced cooling and tension control systems protect delicate substrates, maintaining their optical, electrical, and mechanical properties for critical applications.
Designed to support both R&D prototyping and large-scale manufacturing, our systems offer scalable performance and versatile material compatibility. The intelligent control interface allows for easy parameter adjustment, ensuring optimal performance across a wide range of advanced base materials and processing requirements.
Our high-precision base material cutting systems deliver industry-leading accuracy for a full range of advanced base materials, including optical glass, quartz, sapphire, and semiconductor substrates. Designed for R&D prototyping and high-volume mass production, these systems achieve tight-tolerance slicing with superior surface quality, eliminating the need for extensive post-processing. The intelligent cutting algorithms and constant temperature control ensure consistent performance across diverse material types and thicknesses.
| NO. | パラメータ | 仕様 |
| 1 | モデル | TCQF400LNC-FM-HL |
| 2 | 切断の原理 | エンドレス・ダイヤモンドワイヤー/物理的切断 |
| 3 | 切断機能 | スライス加工/角度・形状切断 |
| 4 | 最大ワークサイズ(mm) | Φ600mm、高さ500mm |
| 5 | 作業台のサイズ(mm) | Ø380 转台 |
| 6 | 切断平面度精度(mm) | 0.08 |
| 7 | 表面粗さ(μm) | Ra 0.8μm |
| 8 | ワイヤの仕様(mm) | Ø0.65–1.0/2580 |
| 9 | テンションシステム | ワイヤ張力の恒常制御 |
| 10 | ガイドホイールの数量 | 4輪 |
| 11 | 駆動モーター | サーボモーター |
| 12 | ワイヤ速度(m/s) | 51Max(調整可能) |
| 13 | 総出力(kW) | 2.8 |
| 14 | 電圧 | 220V 50Hz |
| 15 | 制御システム | 特注開発のTongcheng T32システム |
| 16 | 外形寸法(長さ×幅×高さ)(mm) | 1350×1066×1968 |
| 17 | 総重量(kg) | 720 |

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