高精度な母材の切断


Ultra-Accurate Diamond Wire Systems for Advanced Substrates

High-value base materials such as optical glass, quartz, sapphire, and semiconductor substrates are essential components in precision optical, RF, and optoelectronic devices. Ultra-precise cutting is required to achieve tight tolerances, superior surface quality, and minimal material loss in these high-value applications.

Our high-precision cutting systems deliver industry-leading accuracy, ensuring clean, burr-free cuts with exceptional dimensional consistency. The advanced cooling and tension control systems protect delicate substrates, maintaining their optical, electrical, and mechanical properties for critical applications.

Designed to support both R&D prototyping and large-scale manufacturing, our systems offer scalable performance and versatile material compatibility. The intelligent control interface allows for easy parameter adjustment, ensuring optimal performance across a wide range of advanced base materials and processing requirements.

Ultra-Precision Diamond Wire Cutting for Base Materials

Our high-precision base material cutting systems deliver industry-leading accuracy for a full range of advanced base materials, including optical glass, quartz, sapphire, and semiconductor substrates. Designed for R&D prototyping and high-volume mass production, these systems achieve tight-tolerance slicing with superior surface quality, eliminating the need for extensive post-processing. The intelligent cutting algorithms and constant temperature control ensure consistent performance across diverse material types and thicknesses.

高精度母材切断

メリット
  • Industry-Leading Precision: Tight tolerance control meets the strict requirements of optical and semiconductor manufacturing.
  • Superior Surface Quality: Low-damage cutting reduces polishing time and costs, improving production efficiency.
  • Versatile Material Support: Processes optical glass, quartz, sapphire, silicon, and other high-value base materials.
  • Scalable Production: Flexible configurations for lab R&D, pilot lines, and full-scale mass production.
  • Optical glass and quartz substrate cutting for optical devices and semiconductors
  • Sapphire wafer slicing for LED and RF devices
  • High-precision base material processing for aerospace and medical electronics
NO.パラメータ仕様
1モデルTCQF400LNC-FM-HL
2切断の原理エンドレス・ダイヤモンドワイヤー/物理的切断
3切断機能スライス加工/角度・形状切断
4最大ワークサイズ(mm)Φ600mm、高さ500mm
5作業台のサイズ(mm)Ø380 转台
6切断平面度精度(mm)0.08
7表面粗さ(μm)Ra 0.8μm
8ワイヤの仕様(mm)Ø0.65–1.0/2580
9テンションシステムワイヤ張力の恒常制御
10ガイドホイールの数量4輪
11駆動モーターサーボモーター
12ワイヤ速度(m/s)51Max(調整可能)
13総出力(kW)2.8
14電圧220V 50Hz
15制御システム特注開発のTongcheng T32システム
16外形寸法(長さ×幅×高さ)(mm)1350×1066×1968
17総重量(kg)720
8

Case Learning: Achieve Top-tier Precision in Base Material Cutting

Process upgrades for high-precision base material cutting greatly improved yield, enhanced material utilization and maintained long-term precision stability.
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