ガラスコア基板の研究開発におけるダイヤモンドワイヤーソー：適している用途とそうでない用途
2026年7月23日
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ダイヤモンドワイヤーソーがガラスコア基板の研究開発においてどのような役割を果たすのか、エッジの損傷をどのように抑制するのか、また、レーザーやブレードによる個片化のどちらが適しているのかについて学びましょう。.
High-Precision Cutting Systems for Sapphire Wafer & Substrate Manufacturing
To maintain the quality and performance of optical and electronic components such as LED chips, photonic devices, and RF modules, and to reduce production yield loss, sapphire substrate fine cutting and precision processing equipment is used.
To maximize production throughput in high-volume manufacturing and keep operating costs as low as possible, cutting equipment should be designed to be highly precise and efficient. Optimal matching of the diamond wire, tension control system and cutting machine is a prerequisite for low-stress and high-yield sapphire processing. A highly efficient cutting system can make a decisive contribution to reducing processing time by providing ultra-narrow kerf loss at high process stability. Depending on the wafer thickness and material properties of the sapphire, the required cutting precision of a substrate processing line varies, and with it the wire tension control and cutting speed to be delivered by the diamond wire saw.
In addition to a high precision in the operating range of the production line, the cutting system used should be as space-saving as possible and have a robust design in order to keep the installation and maintenance effort low. The latter applies in particular to automated processing lines used in high-volume fabs. If the cutting system is used in cleanroom environments, the high reliability and low contamination requirements of the diamond wire cutting equipment used must also be taken into account.
The Sapphire Substrate Cutting Systems are a series specially developed for ultra-precision sapphire wafer slicing and fine cutting. The maximum shaft power of the cutting system is matched to the rated motor power and speed of common standard production lines. Thanks to an efficient diamond wire-guide combination, a very high cutting performance is achieved. The design of the Sapphire Cutting System with optimized wire path geometry enables ultra-narrow kerf loss and low-stress processing.
enabled by special high-precision wire tension control that provides consistent cutting accuracy.
without additional contamination risks, as optimized system design ensures minimal particle generation.
thanks to cutting system engineered for optimum material yield and maximum utilization of sapphire blanks.
as robust high-rigidity frame design generates less mechanical wear and requires less frequent maintenance.
| NO. | パラメータ | 仕様 |
| 1 | モデル | TCQF400LNC-FM-HL |
| 2 | 切断の原理 | Endless diamond wire / Physical cutting |
| 3 | Cutting Functions | Slicing / Angle & Profile Cutting |
| 4 | Maximum Workpiece Size(mm) | Φ600mm, Height 500mm |
| 5 | Worktable Size(mm) | Ø380 转台 |
| 6 | Cutting Planarity Accuracy(mm) | 0.08 |
| 7 | Surface Roughness(μm) | Ra 0.8μm |
| 8 | Wire Specification(mm) | Ø0.65–1.0/2580 |
| 9 | テンションシステム | Constant Wire Tension Control |
| 10 | ガイドホイールの数量 | 4 wheels |
| 11 | 駆動モーター | Servo motor |
| 12 | Wire Speed (m/s) | 51Max（Adjustable） |
| 13 | Total Power | 2.8 |
| 14 | Voltage | 220v 50Hz |
| 15 | 制御システム | Custom-developed Tongcheng T32 system |
| 16 | Footprint (L×W×H)(mm) | 1350×1066×1968 |
| 17 | Gross Weight kg | 720 |
ダイヤモンドワイヤーソーがガラスコア基板の研究開発においてどのような役割を果たすのか、エッジの損傷をどのように抑制するのか、また、レーザーやブレードによる個片化のどちらが適しているのかについて学びましょう。.
ダイヤモンドワイヤーソーを用いたNdFeB磁石の切断において、波打ち、欠け、ワイヤーの摩耗、および材料の損失を抑制する方法について、測定可能な試作計画を通じて学びましょう。.
試行錯誤によるパラメータ変更ではなく、ワイヤ経路、張力、負荷、冷却液、摩耗、および固定具の状態といった証拠に基づいて、ダイヤモンドワイヤーソーの破損原因を診断する。.
AlN基板の切断におけるダイヤモンドワイヤーソー加工の適格性評価方法、チッピングや表面下損傷の抑制方法、および実験用・量産用装置の選定方法について学びます。.
ダイヤモンドワイヤーソー技術が、半導体パッケージング、パワーエレクトロニクス、および精密部品向けの先端セラミック切断をどのように向上させるかをご覧ください。.
ダイヤモンドワイヤーソー技術が、LED、RF、光学、半導体用途におけるサファイア基板の切断をどのように改善するかについてご紹介します。.
