ガラスコア基板の研究開発におけるダイヤモンドワイヤーソー：適している用途とそうでない用途
2026年7月23日
コメントはまだありません
ダイヤモンドワイヤーソーがガラスコア基板の研究開発においてどのような役割を果たすのか、エッジの損傷をどのように抑制するのか、また、レーザーやブレードによる個片化のどちらが適しているのかについて学びましょう。.
High-precision Diamond Wire Cutting Machines for Wafer Processing
Indoor wafer slicing systems for semiconductor fabs, R&D labs, pilot lines and other advanced manufacturing facilities require a combination of ultra-precision, high material yield and long-term operational stability. They deliver consistent, damage-free slicing of hard-brittle materials without compromising surface quality or production throughput.
Cutting precision and process efficiency play a particularly critical role in the design of diamond wire cutting equipment for semiconductor manufacturing. They must also be engineered to be as resource-efficient as possible in terms of footprint, installation effort and routine maintenance. The core component that defines a cutting system’s performance is the diamond wire cutting mechanism and its integrated control modules.
General semiconductor cutting solutions from ewirexon therefore combine exceptional slicing accuracy, compact equipment design, flexible material compatibility and optimized production efficiency. In this way, we support you in meeting strict industry quality standards and regulatory requirements, especially for high-yield semiconductor substrate processing.
The diamond wire cutting systems of the ewirexon have been specially developed for use in semiconductor slicing, R&D prototyping and pilot production lines. They are engineered to meet the most stringent precision and yield performance requirements specified for wafer and substrate processing.
With their optimized wire path and tension control mechanisms for maximum cutting stability, ewirexon general cutting systems cover a versatile operating range with highest efficiency. This gives semiconductor equipment manufacturers and material processing facilities the opportunity to drastically reduce their configuration complexity and thus the costs and effort involved in system integration and vendor management.
Reduced total cost of ownership & enhanced production performance:
Thanks to factory-calibrated wire tension control and ultra-stable cutting mechanisms, no on-site re-calibration is required after installation.
Compact, modular equipment design simplifies integration, extends maintenance intervals and thus maximizes uptime for your production lines.
Robust, wear-resistant core components tailored to high-load processing boost operational reliability and reduce unplanned downtime and replacement costs.
Precision-engineered wire path and process control systems deliver damage-free slicing with ultra-high material yield, minimizing material waste and operational costs.
| NO. | パラメータ | 仕様 |
| 1 | モデル | EW-D2236 |
| 2 | ワークピースキャリアプレートのサイズ | 110 × 360 mm |
| 3 | ワークピースの最大加工範囲 | 220 × 360 mm |
| 4 | 切断の寸法精度 | ±0.02 mm |
| 5 | 作業台の送り速度範囲 | 0 ～ 1000 mm/h |
| 6 | 作業台の垂直方向の移動量 | 200 mm |
| 7 | ガイドホイールの数量 | 8輪 |
| 8 | 定格総出力 | 22 kW |
| 9 | 外形寸法（長さ×幅×高さ） | 1942 × 1522 × 2200 mm |
| 10 | 総重量 | 4800 kg |
A leading manufacturer of silicon wafers, compound semiconductors and advanced substrate solutions in Southeast Asia partnered with ewirexon to optimize its wafer slicing operations. By switching to our general semiconductor diamond wire cutting systems, the customer streamlined its slicing workflow and reduced equipment configuration complexity by 30%. The standardization of cutting solutions saved time and inventory costs while further boosting material yield and production throughput — which in turn helps end fabs reduce total cost of ownership.
Want to know more project cases? Feel free to write us!
ダイヤモンドワイヤーソーがガラスコア基板の研究開発においてどのような役割を果たすのか、エッジの損傷をどのように抑制するのか、また、レーザーやブレードによる個片化のどちらが適しているのかについて学びましょう。.
ダイヤモンドワイヤーソーを用いたNdFeB磁石の切断において、波打ち、欠け、ワイヤーの摩耗、および材料の損失を抑制する方法について、測定可能な試作計画を通じて学びましょう。.
試行錯誤によるパラメータ変更ではなく、ワイヤ経路、張力、負荷、冷却液、摩耗、および固定具の状態といった証拠に基づいて、ダイヤモンドワイヤーソーの破損原因を診断する。.
AlN基板の切断におけるダイヤモンドワイヤーソー加工の適格性評価方法、チッピングや表面下損傷の抑制方法、および実験用・量産用装置の選定方法について学びます。.
ダイヤモンドワイヤーソー技術が、半導体パッケージング、パワーエレクトロニクス、および精密部品向けの先端セラミック切断をどのように向上させるかをご覧ください。.
ダイヤモンドワイヤーソー技術が、LED、RF、光学、半導体用途におけるサファイア基板の切断をどのように改善するかについてご紹介します。.
