지르코니아 세라믹 부품 절단


High-Precision Diamond Wire Cutting Systems for Structural Ceramic & Component Machining

Structural ceramic and zirconia component processing is indispensable in a wide variety of advanced manufacturing industries, where the demand for high-precision, complex-shaped ceramic parts can hardly be avoided. Typical end applications include mechanical engineering components, medical ceramic implants, industrial structural parts, as well as electronic ceramic substrates and high-temperature ceramic components.

The common task of the various cutting systems is to process hard, brittle ceramic materials with ultra-tight dimensional accuracy, to achieve minimal kerf loss and sub-surface damage via optimized wire tension control and precision tooling depending on the material, and to deliver finished parts ready for post-processing. This maximizes material yield and ensures the reliability of ceramic components in end applications. In order to make the whole production process cost-efficient and to create stable, high-quality output around the equipment, the diamond wire cutting systems used in the production lines must have high process stability and low maintenance requirements. We offer you the appropriate cutting solutions for this application, which at the same time comply with the latest industry standards for precision and performance

Zirconia & Structural Ceramic Cutting

장점
  • Flexible production line integration
  • As compact cutting system design with multiple wire tension control modes allows space-saving plant layouts.
  • High material yield & low kerf loss
  • Even ultra-thin substrate requirements are met thanks to the precision wire path and low-stress cutting performance of the system.
  • Efficient, long-lasting system design with low maintenance costs
  • made possible by cutting systems that are optimally matched to the material, maximum use of the wire’s cutting potential, and whose structural strength has been confirmed in cycle tests.
  • Structural ceramic component machining
  • Zirconia ceramic part cutting & profiling
  • High-hardness technical ceramic processing
  • Industrial ceramic structural component manufacturing
  • Medical ceramic implant blank slicing
  • Mechanical engineering ceramic parts processing
  • High-temperature ceramic component dicing
아니요.매개변수사양
1모델TCQF400LNC-FM-HL
2절단 원리무한 다이아몬드 와이어 / 물리적 절단
3절단 기능슬라이싱 / 각도 및 단면 절단
4최대 공작물 크기(mm)Φ600mm, 높이 500mm
5작업대 크기(mm)Ø380 转台
6절단 평탄도 정밀도(mm)0.08
7표면 거칠기(μm)Ra 0.8μm
8와이어 사양(mm)Ø0.65–1.0/2580
9장력 시스템일정한 와이어 장력 제어
10가이드 휠 수량4륜
11구동 모터서보 모터
12와이어 속도 (m/s)51Max(조절 가능)
13총 출력(kW)2.8
14전압220V 50Hz
15제어 시스템맞춤 개발된 통청 T32 시스템
16치수 (길이×폭×높이)(mm)1350×1066×1968
17총 중량 (kg)720
10

Case Study: Zirconia & Structural Ceramic Parts Cutting

A semiconductor manufacturer partnered with ewirexon to upgrade its cutting process for ceramic components, achieving higher yield, lower material waste, and consistent production precision.
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