Microelectronic components and precision substrates experience extreme stress during high-speed slicing. To ensure ultra-high precision, minimal sub-surface damage and avoid chip cracking that lead to performance loss, device manufacturers require stable cutting dynamics and precise process control. This is the only way to achieve reliable, high-yield production of microelectronic components.

Microelectronic processing involves high material and production costs. Around 30% of total manufacturing cost is attributed to inefficient cutting, excessive kerf loss and low yield. The application-specific selection of ewirexon diamond wire cutting systems can therefore make a decisive contribution to reducing production costs.

High-precision wire saws are used to slice hard, brittle components into thin wafers with stable tension control. Their operating parameters typically lie in the optimal process window, which is characterized by consistent tension, low vibration and narrow cutting width.