ewirexon infrared optical component cutting solutions support precision slicing and profile cutting of IR optical materials and brittle optical substrates. Typical materials include germanium, silicon for infrared optics, ZnS, ZnSe, chalcogenide glass and related optical blanks that require low cutting stress and controlled edge quality.
Infrared optical materials are often expensive and sensitive to cracks, edge damage and thermal stress. Diamond wire cutting uses a narrow kerf and controlled feed to improve material utilization and reduce the amount of downstream grinding or polishing required after cutting.
To evaluate a cutting solution, provide material type, drawing or sample dimensions, target tolerance, allowable edge chipping, surface condition after cutting and production volume. ewirexon can support cutting trials and custom equipment development for demanding infrared optics workflows.
