Precision Diamond Wire Cutting Solutions for PV Manufacturing
Monocrystalline and polycrystalline silicon ingots are the foundational raw materials for high-efficiency photovoltaic solar cells. Precision slicing into ultra-thin wafers is a critical process that directly determines material utilization, wafer quality, and solar module conversion efficiency. Diamond wire cutting has become the global industry standard, delivering far higher efficiency, lower kerf loss, and superior surface quality than traditional slurry sawing.
In modern PV production lines, diamond wire saws perform multi-wire reciprocating cutting to slice ingots into hundreds of wafers in a single pass. The process demands extreme precision in wire tension, cutting speed, and cooling to ensure consistent thickness, minimal breakage, and low surface damage—key requirements for high-performance N-type and P-type solar cells.
Our diamond wire cutting systems deliver ultra-low kerf loss to maximize material yield, high throughput to reduce production costs, and stable operation for large-size ingots (up to G12+), meeting the evolving demands of the global solar industry.
| SỐ. | Tham số | Thông số kỹ thuật |
| 1 | Mẫu | TCQF15030CNC |
| 2 | Nguyên lý cắt | Dây kim cương vô tận / Cắt cơ học |
| 3 | Các chức năng cắt | Slicing / 2D Contour Cutting |
| 4 | Kích thước tối đa của phôi (mm) | 1200 × 1000 × 1000 mm(L×W×H) |
| 5 | Kích thước bàn làm việc (mm) | 1500×300 |
| 6 | Độ chính xác về độ phẳng khi cắt (mm) | 0.1 |
| 7 | Độ nhám bề mặt (μm) | Ra 0,8 μm |
| 8 | Thông số kỹ thuật dây (mm) | Ø0.65–1.0/6250 |
| 9 | Hệ thống căng dây | Kiểm soát độ căng dây không đổi |
| 10 | Số lượng bánh dẫn hướng | 4 bánh xe |
| 11 | Động cơ truyền động | Động cơ servo |
| 12 | Tốc độ dây (m/s) | 51Max (Có thể điều chỉnh) |
| 13 | Tổng công suất (kW) | 3.6 |
| 14 | Điện áp | 220 V, 50 Hz |
| 15 | Hệ thống điều khiển | Custom-developed Tongcheng T33 system |
| 16 | Kích thước (Dài × Rộng × Cao) (mm) | 3200×1500×1500 |
| 17 | Trọng lượng tổng kg | 3200 |
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine
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