We are pleased to announce that ewirexon, a professional manufacturer of precision diamond wire cutting machines, will participate in CIOE 2026 (27th China International Optoelectronic Exposition) alongside the International IC Innovation Expo (IICIE) and Shenzhen International Electronics Show (ELEXCON).
Taking place from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), this three-in-one industrial exhibition gathers global leaders in optoelectronics, semiconductors, electronic manufacturing and advanced materials. As a long-term provider of high-efficiency, high-precision cutting solutions, we will showcase our full series of diamond wire cutting equipment tailored for optical components, semiconductor substrates, advanced ceramics, crystals and other hard & brittle materials.
Exhibition Overview
- Event: CIOE 2026 + IICIE + ELEXCON
- Date: September 9 – 11, 2026
- Venue: Shenzhen World Exhibition & Convention Center (Bao’an)
- Our Booth: Hall 5, Booth 5D74
What We Will Display
Our exhibition focuses on stable, high-precision and low-damage processing solutions for industrial manufacturing and R&D applications. Highlights include:
- Precision cutting for optical materials: Optical glass, laser crystals, lenses, prisms and window pieces
- Semiconductor & substrate slicing: SiC, sapphire, monocrystalline silicon, ceramic substrates and wafers
- Advanced hard & brittle materials: Ferrite, magnetic materials, engineering ceramics and composite materials
- Compact & industrial models: Machines for R&D laboratories, small-batch production and mass manufacturing lines
- Integrated solutions: Equipment, diamond wire consumables, process optimization and after-sales support
Why Visit Our Booth
- Live cutting demonstrations with real materials
- Professional technical consultation on process parameters and material adaptability
- Successful application cases shared with global customers in optics, semiconductor and new energy industries
- Customized solutions for special shapes, ultra-thin cutting and high-volume production
- Exclusive exhibition-only offers and on-site negotiation support
Meet Our Team
We welcome new and existing partners, distributors and end-users to visit our booth for face-to-face communication. Whether you are looking for higher cutting precision, lower material loss, more stable production or better cost efficiency, our technical and sales team will provide professional and targeted support.
To schedule an appointment in advance, please contact us via:
- Email: serena@ewirexon.com
- Phone / WhatsApp: +86-17521086752
- Website: www.ewirexon.com
We Look Forward to Meeting You in Shenzhen
CIOE 2026 is an important platform for us to communicate with the global optoelectronic and semiconductor industry. We will continue to focus on high-performance diamond wire cutting technology, providing reliable equipment and services for customers worldwide.
See you in Shenzhen!