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  • Products

    Semiconductor Line

    • Silicon Wafer Slicing
    • SiC & Compound Semiconductor Processing
    • Microelectronic Component Precision Cutting
    • Chip Carrier & Package Material Cutting
    • Silicon Wafer Slicing
    • SiC & Compound Semiconductor Processing
    • Microelectronic Component Precision Cutting
    • Chip Carrier & Package Material Cutting

    Ceramic Line

    • Aluminum Nitride (AlN) Substrate Slicing
    • Zirconia & Structural Ceramic Parts Cutting
    • Electronic Ceramic Substrate Processing
    • High-hardness Ceramic Component Machining
    • Aluminum Nitride (AlN) Substrate Slicing
    • Zirconia & Structural Ceramic Parts Cutting
    • Electronic Ceramic Substrate Processing
    • High-hardness Ceramic Component Machining

    Optics Line

    • Sapphire Substrate Fine Cutting
    • Quartz Crystal & Optical Glass Slicing
    • Infrared Optical Component Machining
    • Precision Optical Wafer Processing
    • Sapphire Substrate Fine Cutting
    • Quartz Crystal & Optical Glass Slicing
    • Infrared Optical Component Machining
    • Precision Optical Wafer Processing

    PV Energy Line

    • Mono/Poly Silicon Ingot Slicing
    • High-efficiency PV Wafer Processing
    • New Energy Battery Material Cutting
    • Photovoltaic Module Auxiliary Material Machining
    • Mono/Poly Silicon Ingot Slicing
    • High-efficiency PV Wafer Processing
    • New Energy Battery Material Cutting
    • Photovoltaic Module Auxiliary Material Machining

    Glass & Substrate Line

    • Thin Glass Panel Profile Cutting
    • Circuit Substrate & PCB Base Material Slicing
    • Brittle Electronic Plate Precision Machining
    • High-precision Base Material Cutting
    • Thin Glass Panel Profile Cutting
    • Circuit Substrate & PCB Base Material Slicing
    • Brittle Electronic Plate Precision Machining
    • High-precision Base Material Cutting

    Advanced Material Line

    • Graphite & Carbon Material Custom Cutting
    • Magnetic Material & Special Crystal Slicing
    • Irregular High-hardness Workpiece Machining
    • New-type Functional Material Processing
    • Graphite & Carbon Material Custom Cutting
    • Magnetic Material & Special Crystal Slicing
    • Irregular High-hardness Workpiece Machining
    • New-type Functional Material Processing
  • Service Solutions
    • Installation & Assembly Service
    • Process Parameter Consulting
    • Customized Equipment Development
    • Professional Technical Training
  • About & Contact
  • News & Updates

ewirexon

No. 8 Pinglin Branch Road, Fengxian District, Shanghai, China

Phone: +86-17521086752

E-Mail: info@ewirexon.com

E-Mail: Serena@ewirexon.com

Shanghai Tongcheng Bochuang Technology Co., Ltd.

No. 8 Pinglin Branch Road, Fengxian District, Shanghai, China

Phone: +86-17521086752

E-Mail: info@ewirexon.com

E-Mail: Serena@ewirexon.com

Shanghai Tongcheng Industry Co., Ltd

No. 8 Pinglin Branch Road, Fengxian District, Shanghai, China

Phone: +86-17521086752

E-Mail: info@ewirexon.com

E-Mail: Serena@ewirexon.com

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