
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Precision Slicing Equipment for Magnetic Materials & Special Crystals
Magnetic materials and special crystals are core to electronics, new energy, and optics, used in motors, sensors, and optical devices. Precision slicing of these hard, brittle materials directly affects performance and yield. Diamond wire cutting has replaced traditional blade slicing, becoming the industry standard for low damage and high consistency.
In mass production, diamond wire saws slice magnetic materials (NdFeB, ferrite) and special crystals, ensuring uniform thickness and no damage to material properties. Precise tension, speed, and cooling control are essential for high-performance components.
Our systems deliver ultra-low damage cutting to preserve material properties, achieve high slicing efficiency, and operate stably in industrial environments, compatible with various hard, brittle materials.
Our diamond wire cutting equipment is specially developed for slicing hard and brittle magnetic materials, rare-earth permanent magnets, ferrite materials, and various special crystals. It achieves stable, low-damage slicing with excellent thickness uniformity, effectively avoiding chipping, cracking, and internal stress damage that often occur in traditional processing. The closed-loop control system ensures high consistency in mass production, making it widely used in motors, sensors, communications, and optical devices.
| NO. | Parameter | Specification |
| 1 | Model | TCQF1000PNC |
| 2 | Cutting Principle | Endless diamond wire, physical cold cutting |
| 3 | Cutting Functions | Flat Cutting / Rotary Slicing |
| 4 | Maximum Workpiece Size(mm) | 380×380×280 mm(L×W×H) |
| 5 | Worktable Size(mm) | Ø1000 转台 |
| 6 | Cutting Planarity Accuracy(mm) | 0.1 |
| 7 | Surface Roughness(μm) | Ra 0.8 μm |
| 8 | Wire Specification(mm) | Ø1.0/4760 |
| 9 | Tension System | Constant Wire Tension Control |
| 10 | Guide Wheel Quantity | 3 wheels |
| 11 | Drive Motor | Servo motor |
| 12 | Wire Speed (m/s) | 51Max(Adjustable) |
| 13 | Total Power (kW) | 3.3 |
| 14 | Voltage | 380v 50Hz |
| 15 | Control System | Custom-developed Tongcheng T31 system |
| 16 | Footprint (L×W×H)(mm) | 2350×2350×2040 |
| 17 | Gross Weight kg | 1850 |

Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain

A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine

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