High-precision Machining Solutions for Irregular High-hardness Workpieces
Irregular high-hardness workpieces (cemented carbide, ceramics, superhard alloys) are widely used in tools, molds, and aerospace, where traditional machining is inefficient. Precision machining is critical for performance and consistency. Diamond wire cutting offers a flexible, low-stress solution for complex shape processing.
In manufacturing, CNC programmable paths enable one-time forming cutting, ensuring high precision and avoiding cracking/deformation. This eliminates multiple traditional steps, greatly improving efficiency and reducing costs.
Our systems deliver high-precision profile cutting for complex shapes, low-stress processing to avoid damage, and stable operation for superhard materials, supporting customized solutions for diverse industrial needs.
Our diamond wire cutting solutions excel at machining irregular, complex-shaped high-hardness workpieces such as cemented carbide, engineering ceramics, superhard alloys, and wear-resistant parts. With flexible path programming and high-rigidity machine design, the system realizes high-precision forming cutting without excessive stress or tool wear. It solves the difficulty of traditional processing for complex hard parts and greatly improves production efficiency and workpiece quality.
| नहीं।. | पैरामीटर | विनिर्देश |
| 1 | मॉडल | टीसीक्यूएफ400एलएनसी-एफएम-एचएल |
| 2 | काटन का सिद्धांत | अनंत हीरे की तार / भौतिक काटना |
| 3 | काटने के कार्य | स्लाइसिंग / कोण और प्रोफ़ाइल कटिंग |
| 4 | अधिकतम वर्कपीस आकार (मिमी) | Φ600 मिमी, ऊँचाई 500 मिमी |
| 5 | कार्य-टेबल का आकार (मिमी) | Ø380 转台 |
| 6 | कटिंग समतलता सटीकता (मिमी) | 0.08 |
| 7 | सतही खुरदरापन (माइक्रोमीटर) | रे 0.8 माइक्रोमीटर |
| 8 | तार विनिर्देश (मिमी) | Ø0.65–1.0/2580 |
| 9 | तनाव प्रणाली | सतत तार तनाव नियंत्रण |
| 10 | गाइड व्हील की मात्रा | चार पहिये |
| 11 | चालक मोटर | सर्भो मोटर |
| 12 | तार की गति (मी/से) | 51मैक्स (समायोज्य) |
| 13 | कुल शक्ति (किलोवाट) | 2.8 |
| 14 | वोल्टेज | 220v 50Hz |
| 15 | नियंत्रण प्रणाली | विशेष रूप से विकसित टोंगचेंग टी32 प्रणाली |
| 16 | फुटप्रिंट (लंबाई×चौड़ाई×ऊंचाई)(मिमी) | १३५०×१०६६×१९६८ |
| 17 | कुल वजन किग्रा | 720 |
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine
Build a SiC wafer metrology control plan after diamond wire saw cutting, covering TTV, flatness, bow, warp, edge chips and subsurface damage.
See how 800 VDC AI data center power architectures change SiC wafer cutting, kerf control, surface damage limits and supplier qualification.
Build a practical SiC slicing cost model using kerf loss, yield, wire life, cycle time, finishing allowance and diamond wire saw data.
Learn how 200 mm SiC wafer slicing changes contact length, wire bow, coolant delivery, TTV control and diamond wire saw qualification.
