
Diamond Wire Saw Factory Acceptance Test: A Practical FAT Guide
Build a measurable diamond wire saw factory acceptance test covering safety, capability, wafers, consumables, data, training and SAT handoff.
Machining Solutions for PV Module Auxiliary Materials
Photovoltaic module production requires precision processing of a range of auxiliary materials, including solar glass, backsheets, aluminum frames, and encapsulation components. Diamond wire cutting delivers clean, stress-free cutting for these brittle and composite materials, ensuring tight tolerances and high edge quality.
Our solutions support customized profile cutting and slicing for all PV module auxiliary materials, enabling high-efficiency, low-waste processing that improves production yield and reduces manufacturing costs for module factories worldwide.
Our diamond wire cutting systems provide precise, stress-free processing for a full range of PV module auxiliary materials, including solar glass, backsheets, aluminum frames, and encapsulation components. Engineered for brittle and composite materials, they deliver clean, burr-free cuts with tight dimensional tolerances, improving production yield and reducing material waste in module manufacturing lines. With customizable profile cutting, they adapt to diverse module designs and production processes.
| NO. | Parameter | Specification |
| 1 | Model | (Customizable, e.g. EW-200) |
| 2 | Cutting Principle | Diamond Wire Mechanical Cold Cutting |
| 3 | Cutting Function | Slicing |
| 4 | Max Workpiece Dimension (L×W×H) | 150 × 150 × 150 mm |
| 5 | Worktable Size (L×W) | 160 × 160 mm |
| 6 | Cutting Flatness Accuracy | ≤ 0.1 mm |
| 7 | Surface Roughness | Ra 0.8 μm |
| 8 | Diamond Wire Specification | Φ0.5 × 1797 mm (Dia. Range: 0.35~0.8 mm) |
| 9 | Tension System | Servo Tension Control |
| 10 | Guide Wheel Quantity | 3 wheels |
| 11 | Drive Motor | Custom Servo Motor |
| 12 | Spindle Speed | 4500 rpm |
| 13 | Main Motor Power | 1.1 kW |
| 14 | Total Power Consumption | 1.5 kW |
| 15 | Power Supply | 220 V / 50 Hz |
| 16 | Control System | Self-developed Tongcheng T30 |
| 17 | Footprint (L×W×H) | Approx. 850 × 800 × 950 mm |
| 18 | Gross Weight | Approx. 560 kg |

Build a measurable diamond wire saw factory acceptance test covering safety, capability, wafers, consumables, data, training and SAT handoff.

Build a subsurface-damage and finishing-allowance budget for diamond wire saw cutting of SiC, silicon, sapphire, glass and ceramics.

Decide when batch or stack cutting advanced ceramics improves throughput without sacrificing chips, thickness, cooling or traceability.
Evaluate ultra-fine diamond wire for thin silicon wafer slicing using kerf, bow, breakage, warp, finishing loss and cost per accepted wafer.

Build a practical diamond wire saw preventive-maintenance plan for guide wheels, tension, alignment, coolant and repeatable wafer quality.

Learn how diamond wire saw cutting can improve graphite component yield for SiC crystal growth while controlling dust, geometry and contamination.
ewirexon.com
Typically replies within minutes
Hi, there, is there anything do for you ?
WhatsApp Us
🟢Online | Privacy policy
WhatsApp us