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ewirexon は精密切断システムソリューションのパートナーです。

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CIOE 2026 in Shenzhenに参加 - 高硬度・脆性材料の精密ダイヤモンドワイヤー切断ソリューション

9月 1, 2026

We are pleased to announce that ewirexon, a professional manufacturer of precision diamond wire cutting machines, will participate in CIOE 2026 (27th China International Optoelectronic Exposition) alongside the International IC Innovation Expo (IICIE) and Shenzhen International Electronics Show (ELEXCON). Taking place from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), this three-in-one industrial exhibition gathers global leaders in optoelectronics,

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硬質材料の精密切削加工：PM CHINA 2026でewirexonがデビュー（ブースL095）

2月 24, 2026

The global hard material processing industry is converging in Shanghai, and ewirexon — the precision cutting brand of Shanghai Tongcheng Industrial Co., Ltd. — is ready to showcase next-generation diamond wire cutting solutions at The 18th China International Exhibition for Powder Metallurgy & Cemented Carbides (PM CHINA 2026), held March 24–26, 2026. Co-located with the Advanced Ceramics, Magnetic Materials, Additive Manufacturing

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高精度に設計。LASER WORLD OF PHOTONICS CHINA 2026 (E4.4359)でewirexonをご覧ください。

2月 18, 2026

Exciting news! Our team is ready to welcome you at LASER WORLD OF PHOTONICS CHINA 2026, taking place March 18-20, 2026 at the Shanghai New International Expo Centre. As one of Asia’s premier gatherings for laser, photonics and precision manufacturing professionals, the event brings together industry leaders, engineers, and innovators from across the globe – and ewirexon, a brand of Shanghai Tongcheng

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