Zirkonya Seramik Parçaların Kesilmesi


High-Precision Diamond Wire Cutting Systems for Structural Ceramic & Component Machining

Structural ceramic and zirconia component processing is indispensable in a wide variety of advanced manufacturing industries, where the demand for high-precision, complex-shaped ceramic parts can hardly be avoided. Typical end applications include mechanical engineering components, medical ceramic implants, industrial structural parts, as well as electronic ceramic substrates and high-temperature ceramic components.

The common task of the various cutting systems is to process hard, brittle ceramic materials with ultra-tight dimensional accuracy, to achieve minimal kerf loss and sub-surface damage via optimized wire tension control and precision tooling depending on the material, and to deliver finished parts ready for post-processing. This maximizes material yield and ensures the reliability of ceramic components in end applications. In order to make the whole production process cost-efficient and to create stable, high-quality output around the equipment, the diamond wire cutting systems used in the production lines must have high process stability and low maintenance requirements. We offer you the appropriate cutting solutions for this application, which at the same time comply with the latest industry standards for precision and performance

Zirconia & Structural Ceramic Cutting

Avantajlar
  • Flexible production line integration
  • As compact cutting system design with multiple wire tension control modes allows space-saving plant layouts.
  • High material yield & low kerf loss
  • Even ultra-thin substrate requirements are met thanks to the precision wire path and low-stress cutting performance of the system.
  • Efficient, long-lasting system design with low maintenance costs
  • made possible by cutting systems that are optimally matched to the material, maximum use of the wire’s cutting potential, and whose structural strength has been confirmed in cycle tests.
  • Structural ceramic component machining
  • Zirconia ceramic part cutting & profiling
  • High-hardness technical ceramic processing
  • Industrial ceramic structural component manufacturing
  • Medical ceramic implant blank slicing
  • Mechanical engineering ceramic parts processing
  • High-temperature ceramic component dicing
HAYIR.ParametreTeknik Özellikler
1ModelTCQF400LNC-FM-HL
2Kesme PrensibiSonsuz elmas tel / Fiziksel kesim
3Kesme İşlevleriDilimleme / Açı ve Profil Kesimi
4Maksimum İş Parçası Boyutu (mm)Φ600 mm, Yükseklik 500 mm
5Çalışma Masası Boyutu (mm)Ø380 转台
6Kesim Düzlük Hassasiyeti (mm)0.08
7Yüzey Pürüzlülüğü (μm)Ra 0,8 μm
8Tel Özellikleri (mm)Ø0,65–1,0/2580
9Gergi SistemiSabit Tel Gerginliği Kontrolü
10Yönlendirme Tekerleği Adedi4 tekerlek
11Tahrik MotoruServo motor
12Tel Hızı (m/s)51Max (Ayarlanabilir)
13Toplam Güç (kW)2.8
14Gerilim220 V 50 Hz
15Kontrol SistemiÖzel olarak geliştirilmiş Tongcheng T32 sistemi
16Kapladığı alan (U×G×Y) (mm)1350×1066×1968
17Brüt Ağırlık (kg)720
ewirexon - ewirexon precision diamond wire cutting system

Case Study: Zirconia & Structural Ceramic Parts Cutting

A semiconductor manufacturer partnered with ewirexon to upgrade its cutting process for ceramic components, achieving higher yield, lower material waste, and consistent production precision.
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