신규 유형 기능성 소재 가공


Advanced Processing Systems for New-type Functional Material Manufacturing

New-type functional materials (composites, 2D materials, energy storage materials) drive cutting-edge industries like new energy and semiconductors. Precision processing unlocks their unique properties, directly determining device performance. Diamond wire cutting is the key technology, offering ultra-low damage and wide compatibility.

In R&D and production, diamond wire systems perform ultra-fine slicing, ensuring minimal subsurface damage and micron-level accuracy. Flexible configurations support both lab prototyping and mass production, adapting to evolving material needs.

Our systems deliver ultra-low damage cutting to protect material performance, high precision for micro-components, and wide material compatibility, supporting next-generation new energy and semiconductor technologies.

Advanced Processing Solutions for New-type Functional Materials

Our diamond wire cutting systems support high-efficiency, high-precision processing of a wide range of new-type functional materials, including composite materials, biomaterials, 2D materials, energy storage materials, and special structural materials. With ultra-fine cutting capability and low-damage processing characteristics, they meet the strict requirements of R&D prototypes and small-batch trial production as well as large-scale mass production.

새로운 유형의 기능성 소재 가공

장점
  • High compatibility with various new functional and composite materials
  • Ultra-low damage to protect material performance and structure
  • Flexible configuration for R&D, pilot and mass production lines
  • High precision and stability for high-value new materials
  • New energy functional materials and energy storage components
  • Biomedical materials and high-performance structural composites
  • Cutting-edge 2D materials and semiconductor functional substrates
아니요.매개변수사양
1모델(사용자 정의 가능, 예: EW-200)
2절단 원리다이아몬드 와이어를 이용한 기계식 냉간 절단
3절단 기능썰기
4공작물 최대 치수 (길이×폭×높이)150 × 150 × 150 mm
5작업대 크기 (길이×너비)160 × 160 mm
6절단 평탄도 정밀도≤ 0.1 mm
7표면 거칠기Ra 0.8 μm
8다이아몬드 와이어 사양Φ0.5 × 1797 mm (직경 범위: 0.35~0.8 mm)
9장력 시스템서보 장력 제어
10가이드 휠 수량3륜
11구동 모터맞춤형 서보 모터
12스핀들 회전 속도4500 rpm
13주 모터 출력1.1 kW
14총 전력 소비량1.5 kW
15전원 공급 장치220 V / 50 Hz
16제어 시스템자체 개발한 통청 T30
17치수 (길이×폭×높이)약 850 × 800 × 950 mm
18총중량약 560kg
ewirexon - ewirexon precision diamond wire cutting system

Read the Case: Upgrade Processing for New Functional Materials

Comprehensive process optimization for new-type functional material processing brought higher yield, lower material loss and stable overall processing precision.
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