電子用セラミック基板の切断

Electronic ceramic substrates are used in a wide variety of semiconductor and electronic manufacturing processes. Without sufficient precision cutting, the dimensional errors and material damage generated during substrate processing can lead to reduced device performance, increased yield loss and consequential failure of the end product. To ensure optimum functionality of multi-layer ceramic components, power modules and electronic packages at all times and to minimize production downtime, reliable, high-precision substrate processing must be ensured.

In addition to ultra-tight dimensional accuracy to meet the packaging requirements, the diamond wire cutting systems used should meet other requirements. Among other things, semiconductor industry quality standards must be complied with, which means that the cutting systems must have very low kerf loss and minimal sub-surface damage. Furthermore, there are high requirements for process stability, for example when used in high-volume production lines, so the systems must be designed so that there is consistent, repeatable cutting performance. In addition, a compact footprint is of great importance when integrated into automated substrate manufacturing lines with limited factory space.