
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Ultra-Accurate Diamond Wire Systems for Advanced Substrates
High-value base materials such as optical glass, quartz, sapphire, and semiconductor substrates are essential components in precision optical, RF, and optoelectronic devices. Ultra-precise cutting is required to achieve tight tolerances, superior surface quality, and minimal material loss in these high-value applications.
Our high-precision cutting systems deliver industry-leading accuracy, ensuring clean, burr-free cuts with exceptional dimensional consistency. The advanced cooling and tension control systems protect delicate substrates, maintaining their optical, electrical, and mechanical properties for critical applications.
Designed to support both R&D prototyping and large-scale manufacturing, our systems offer scalable performance and versatile material compatibility. The intelligent control interface allows for easy parameter adjustment, ensuring optimal performance across a wide range of advanced base materials and processing requirements.
Our high-precision base material cutting systems deliver industry-leading accuracy for a full range of advanced base materials, including optical glass, quartz, sapphire, and semiconductor substrates. Designed for R&D prototyping and high-volume mass production, these systems achieve tight-tolerance slicing with superior surface quality, eliminating the need for extensive post-processing. The intelligent cutting algorithms and constant temperature control ensure consistent performance across diverse material types and thicknesses.
| 不. | 参数 | 规格 |
| 1 | 模型 | TCQF400LNC-FM-HL |
| 2 | 切割原理 | 无尽金刚石线/物理切割 |
| 3 | 切割功能 | 切片 / 角材和型材切割 |
| 4 | 最大工件尺寸(毫米) | Φ600毫米,高度500毫米 |
| 5 | 工作台尺寸(毫米) | Ø380 转台 |
| 6 | 切割平面精度(毫米) | 0.08 |
| 7 | 表面粗糙度(μm) | Ra 0.8μm |
| 8 | 电线规格(毫米) | Ø0.65-1.0/2580 |
| 9 | 张力系统 | 恒线张力控制 |
| 10 | 导轮数量 | 4 轮 |
| 11 | 驱动电机 | 伺服电机 |
| 12 | 线速(米/秒) | 51Max(可调) |
| 13 | 总功率(千瓦) | 2.8 |
| 14 | 电压 | 220 伏 50 赫兹 |
| 15 | 控制系统 | 定制开发的通程 T32 系统 |
| 16 | 占地面积(长×宽×高)(毫米) | 1350×1066×1968 |
| 17 | 毛重 千克 | 720 |

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