उच्च सटीकता वाली आधार सामग्री की कटाई


Ultra-Accurate Diamond Wire Systems for Advanced Substrates

High-value base materials such as optical glass, quartz, sapphire, and semiconductor substrates are essential components in precision optical, RF, and optoelectronic devices. Ultra-precise cutting is required to achieve tight tolerances, superior surface quality, and minimal material loss in these high-value applications.

Our high-precision cutting systems deliver industry-leading accuracy, ensuring clean, burr-free cuts with exceptional dimensional consistency. The advanced cooling and tension control systems protect delicate substrates, maintaining their optical, electrical, and mechanical properties for critical applications.

Designed to support both R&D prototyping and large-scale manufacturing, our systems offer scalable performance and versatile material compatibility. The intelligent control interface allows for easy parameter adjustment, ensuring optimal performance across a wide range of advanced base materials and processing requirements.

Ultra-Precision Diamond Wire Cutting for Base Materials

Our high-precision base material cutting systems deliver industry-leading accuracy for a full range of advanced base materials, including optical glass, quartz, sapphire, and semiconductor substrates. Designed for R&D prototyping and high-volume mass production, these systems achieve tight-tolerance slicing with superior surface quality, eliminating the need for extensive post-processing. The intelligent cutting algorithms and constant temperature control ensure consistent performance across diverse material types and thicknesses.

उच्च-सटीकता आधार सामग्री काटने

लाभ
  • Industry-Leading Precision: Tight tolerance control meets the strict requirements of optical and semiconductor manufacturing.
  • Superior Surface Quality: Low-damage cutting reduces polishing time and costs, improving production efficiency.
  • Versatile Material Support: Processes optical glass, quartz, sapphire, silicon, and other high-value base materials.
  • Scalable Production: Flexible configurations for lab R&D, pilot lines, and full-scale mass production.
  • Optical glass and quartz substrate cutting for optical devices and semiconductors
  • Sapphire wafer slicing for LED and RF devices
  • High-precision base material processing for aerospace and medical electronics
नहीं।.पैरामीटरविनिर्देश
1मॉडलटीसीक्यूएफ400एलएनसी-एफएम-एचएल
2काटन का सिद्धांतअनंत हीरे की तार / भौतिक काटना
3काटने के कार्यस्लाइसिंग / कोण और प्रोफ़ाइल कटिंग
4अधिकतम वर्कपीस आकार (मिमी)Φ600 मिमी, ऊँचाई 500 मिमी
5कार्य-टेबल का आकार (मिमी)Ø380 转台
6कटिंग समतलता सटीकता (मिमी)0.08
7सतही खुरदरापन (माइक्रोमीटर)रे 0.8 माइक्रोमीटर
8तार विनिर्देश (मिमी)Ø0.65–1.0/2580
9तनाव प्रणालीसतत तार तनाव नियंत्रण
10गाइड व्हील की मात्राचार पहिये
11चालक मोटरसर्भो मोटर
12तार की गति (मी/से)51मैक्स (समायोज्य)
13कुल शक्ति (किलोवाट)2.8
14वोल्टेज220v 50Hz
15नियंत्रण प्रणालीविशेष रूप से विकसित टोंगचेंग टी32 प्रणाली
16फुटप्रिंट (लंबाई×चौड़ाई×ऊंचाई)(मिमी)१३५०×१०६६×१९६८
17कुल वजन किग्रा720
8

Case Learning: Achieve Top-tier Precision in Base Material Cutting

Process upgrades for high-precision base material cutting greatly improved yield, enhanced material utilization and maintained long-term precision stability.
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