
Sawing Temperature in SiC Wafer Cutting: A Diamond Wire Saw Control Guide
Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain
Precision Diamond Wire Cutting for Solar Wafer Production
High-efficiency N-type and P-type solar wafers are the core of next-generation photovoltaic modules. Precision diamond wire cutting is critical to producing ultra-thin, high-quality wafers that maximize cell conversion efficiency and material yield. This process has replaced traditional sawing, delivering lower kerf loss, higher throughput, and superior surface quality for mass PV manufacturing.
Our diamond wire systems ensure consistent wafer thickness, minimal breakage, and controlled surface damage, enabling high-throughput production of ultra-thin wafers while meeting the strict quality requirements of modern solar cell technologies.
Our diamond wire cutting solutions are tailored for high-efficiency PV wafer production, delivering ultra-thin, high-quality wafers that directly boost solar cell conversion efficiency. The systems feature advanced wire path optimization and real-time monitoring, ensuring consistent thickness, flatness, and surface quality for N-type TOPCon, HJT, and other next-generation solar cells. With low-damage cutting technology, they minimize wafer warpage and micro-cracks, significantly improving cell yield and module performance.
| NO. | パラメータ | 仕様 |
| 1 | モデル | TCQF15030CNC |
| 2 | 切断の原理 | エンドレス・ダイヤモンドワイヤー/物理的切断 |
| 3 | 切断機能 | Slicing / 2D Contour Cutting |
| 4 | 最大ワークサイズ(mm) | 1200 × 1000 × 1000 mm(L×W×H) |
| 5 | 作業台のサイズ(mm) | 1500×300 |
| 6 | 切断平面度精度(mm) | 0.1 |
| 7 | 表面粗さ(μm) | Ra 0.8 μm |
| 8 | ワイヤの仕様(mm) | Ø0.65–1.0/6250 |
| 9 | テンションシステム | ワイヤ張力の恒常制御 |
| 10 | ガイドホイールの数量 | 4輪 |
| 11 | 駆動モーター | サーボモーター |
| 12 | ワイヤ速度(m/s) | 51Max(調整可能) |
| 13 | Total Power | 3.6 |
| 14 | 電圧 | 220V 50Hz |
| 15 | 制御システム | Custom-developed Tongcheng T33 system |
| 16 | 外形寸法(長さ×幅×高さ)(mm) | 3200×1500×1500 |
| 17 | 総重量(kg) | 3200 |

Temperature is easy to treat as a secondary variable in SiC wafer cutting. A machine may report stable wire speed, the coolant tank may remain

A diamond wire can continue moving long after it has stopped cutting economically. It may not be broken, alarms may remain clear, and the machine

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