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PVウェハのスライシングソリューション

Precision Diamond Wire Cutting for Solar Wafer Production

High-efficiency N-type and P-type solar wafers are the core of next-generation photovoltaic modules. Precision diamond wire cutting is critical to producing ultra-thin, high-quality wafers that maximize cell conversion efficiency and material yield. This process has replaced traditional sawing, delivering lower kerf loss, higher throughput, and superior surface quality for mass PV manufacturing.

Our diamond wire systems ensure consistent wafer thickness, minimal breakage, and controlled surface damage, enabling high-throughput production of ultra-thin wafers while meeting the strict quality requirements of modern solar cell technologies.

Precision Diamond Wire Cutting for High-Efficiency Solar Wafers

Our diamond wire cutting solutions are tailored for high-efficiency PV wafer production, delivering ultra-thin, high-quality wafers that directly boost solar cell conversion efficiency. The systems feature advanced wire path optimization and real-time monitoring, ensuring consistent thickness, flatness, and surface quality for N-type TOPCon, HJT, and other next-generation solar cells. With low-damage cutting technology, they minimize wafer warpage and micro-cracks, significantly improving cell yield and module performance.

高効率PVウェハープロセス

Core Benefits
  • Ultra-Thin Wafer Capability: Achieve stable slicing of wafers as thin as 100μm, reducing silicon usage and lowering cell costs.
  • Superior Surface Quality: Low-damage cutting eliminates the need for extensive post-processing, simplifying production steps.
  • High Yield & Low Breakage: Intelligent cutting algorithms reduce wafer breakage rate to below 1%, maximizing production yield.
  • Energy & Cost Savings: High-efficiency cutting design reduces power consumption per wafer, cutting operational expenses.
  • High-efficiency N-type/P-type solar wafer manufacturing
  • Ultra-thin wafer processing for HJT, TOPCon, and IBC cells
  • Wafer slicing for bifacial and high-power PV modules
NO.パラメータ仕様
1モデルTCQF15030CNC
2切断の原理エンドレス・ダイヤモンドワイヤー／物理的切断
3切断機能Slicing / 2D Contour Cutting
4最大ワークサイズ（mm）1200 × 1000 × 1000 mm(L×W×H)
5作業台のサイズ（mm）1500×300
6切断平面度精度（mm）0.1
7表面粗さ（μm）Ra 0.8 μm
8ワイヤの仕様（mm）Ø0.65–1.0/6250
9テンションシステムワイヤ張力の恒常制御
10ガイドホイールの数量4輪
11駆動モーターサーボモーター
12ワイヤ速度（m/s）51Max（調整可能）
13総出力3.6
14電圧220V 50Hz
15制御システムCustom-developed Tongcheng T33 system
16外形寸法（長さ×幅×高さ）（mm）3200×1500×1500
17総重量（kg）3200
12

Case Learning: Enhance PV Wafer Processing Efficiency

Our cooperation in high-efficiency PV wafer processing optimized production lines, resulting in higher yield, lower material consumption and sustained processing precision.
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